NXP Semiconductors and Wayv have unveiled the world’s first battery operated, handheld portable cooking appliance, the Wayv Adventurer. Designed to be compact, rugged and light-weight, the Wayv Adventurer is intended to give people the flexibility to efficiently and conveniently heat food anytime and anywhere.

In readiness for the next revolution in high speed home and small-business (SMB) broadband, NXP Semiconductors has introduced an expanded gateway platform scaling from 1Gbps at extreme low power, all the way to 20Gbps of bi-directional wireline/WiFi performance at the high end.

NXP Semiconductors has announced new solid state RF cooking modules to accompany its popular RF cooking components portfolio. The module is designed to help engineers rapidly build innovative RF cooking appliances that can achieve a better way of highly efficient, uniform heating, adaptability and consistency of the cooking process than conventional radiant or convection methods.

At NXP Semiconductor’s annual user conference, NXP FTF 2016, the company is showcasing new solutions to help engineers and developers create secure, smart, connected experiences. A key theme for the event is the future smart city, which presents a complex, multi-vertical opportunity for the IoT that crosses public and private sectors.

NXP Semiconductors expands its support for the electronic payments market by introducing a point-of-sale (POS) reader solution platform, SLN-POS-RDR, to enable customers to quickly develop and launch secure, contact and contactless payment systems into the market. The rapidly evolving market of electronic payments introduces new, innovative form factors, use cases and integration levels for the latest payment devices.

NXP Semiconductors has announced four new laterally diffused metal oxide semiconductor (LDMOS) RF power transistors that allow designers of solid-state cooking solutions to customise their products in both frequency and RF output power. They were designed exclusively to be used in cooking appliances and are incorporated within NXP's new solid-state RF cooking module.

NXP Semiconductors has introduced an innovative vertical integration technology called V-Link and will be demonstrating at the NXP Technology Forum the first product in the line-up which is based on the i.MX 6SoloX single chip module (SCM). The V-Link bus allows customers to customise their own system adding connectivity, sensing, and other innovative off-the-shelf solutions on top of the base SCM device through package-on-package assembly techno...

NXP Semiconductors has debuted the potential of secure, vivid and interactive interfaces powered by next gen i.MX 8 applications processors. NXP also introduced a multisensory enablement kit (MEK) based on i.MX 8, a multisensory processor family that promises to transform everyday interactions by advancing multimedia and display interfaces across demanding compute and media-intensive applications.

Marking a significant milestone in the fast-approaching self-driving vehicles era, NXP Semiconductors has demonstrated a comprehensive and highly manufacturable autonomous vehicles platform leveraging NXP’s BlueBox engine and deploying NXP silicon and software solutions at each ADAS node. The system demonstration incorporates the BlueBox central computing engine, together with radar, lidar, and vision sensing, as well as an onboard secure V...

Students from Haute Ecole ARC Ingénierie, Switzerland won the Grand Final of the NXP Cup EMEA Challenge 2016. They prevailed and won the race after a fierce competition that brought together the winners from regional rounds around Europe. The 16 teams were from universities and high schools in Germany, Switzerland, UK, France, Italy, Greece, Romania, Poland, Ukraine as well as Morocco.

Addressing the growing industry demand for a cost-effective, flexible and scalable platform architecture to enable existing and emerging LED lighting features, NXP Semiconductors has announced its multi-channel LED driver IC portfolio for automotive exterior lighting. The two families, the multiphase boost ASLx500 and multichannel buck ASLx416 driver ICs, are both based on NXP's automotive qualified ABCD9 technology - a platform for mixed-signal,...

NXP Semiconductors N.V. has introduced ICODE DNA to its family of ICODE products. As part of its continuing commitment to deliver secure identification solutions, NXP’s ICODE DNA enhances security for vicinity applications by enabling tag authentication and privacy protection based on cryptographic security. NXP will showcase its ICODE DNA device, with products and customer programmable originality signatures at RFID Journal Live, May 3-5th...

NXP Semiconductors has introduced what it claims to be the most powerful RF transistor in any technology operating at any frequency. Designed to deliver 1.50kW CW at 50V, the MRF1K50H can reduce the number of transistors in high-power RF amplifiers, which helps to reduce amplifier size and BoM.

NXP Semiconductors has introduced the HB2000 and HB2001 advanced brushed DC motor drivers. These motor drivers target automotive applications that require functionally safe vehicle electrification like throttle control, cruise control, turbo flaps and fuel flaps.

Expanding its QorIQ processor family, NXP Semiconductors has announced the LS1046A, which is claimed to be the industry’s lowest power quad-core ARM Cortex-A72 based processor. The product combines extreme power efficiency with the QorIQ portfolio’s signature scalability and breadth, delivering compelling benefits for the industrial, enterprise router/switching and CPE/vCPE (virtual Customer Premise Equipment) markets.

NXP Semiconductor has released the 'industry’s first' 15W multi-standard wireless charging solution simultaneously supporting both 15W WPC Qi and 5W PMA standards, further extending its wireless charging portfolio. Additionally the company unveiled a new high efficiency multi-standard, Type-C charging adapters with aims to deliver a fast and smart charging experience.

NXP Semiconductors has announced that its Software Development Kit (SDK) for Kinetis MCUs offers support for home automation applications using Apple HomeKit technology. Leveraging the outstanding performance and advanced Bluetooth Smart connectivity of NXP’s Kinetis products, the solution streamlines development for a wide range of HomeKit compatible products.

NXP Semiconductors N.V. has set a benchmark in RF power performance with four new LDMOS transistors. The new transistors aim to deliver best-in class performance for defense radar and Identification Friend or Foe (IFF) systems operating between 900 and 1400MHz. Several defense contractors are currently developing and evaluating systems with these high capability transistors. 

NXP Semiconductors N.V. has announced a strategic collaboration with HID Global. The HID Global Seos credential technology will be embedded in NXP’s SmartMX-based secure element devices. Through the collaboration, NXP and HID Global aim to enable the use of wearable devices, to open electronic locks at commercial buildings, hotels and workplaces in the future.

NXP Semiconductor has released the industry's first software SDK for ZigBee 3.0. The NXP ZigBee 3.0 software is available for JN5169, JN5168 and JN5164 MCUs. With the ZigBee 3.0 SDK, home automation developers and operators can further explore product development for Smart Home, Smart Appliances in domestic and commercial environments including lighting, HVAC and security devices.