PLI (Plasticard-Locktech International), the world's largest manufacturer of hotel keycards, has signed a large-scale and long-term supply agreement with Smartrac, featuring NXP MIFARE ICs. For Smartrac, the agreement means a breakthrough in the global hospitality, leisure and entertainment market, while PLI and its customers will benefit from a quantum leap in product capability, quality and security.

NXP Semiconductors has introduced what it claims to be the industry’s largest portfolio of broadband 28V LDMOS two-stage, dual-path Doherty-optimised ICs for small cell base stations. The LDMOS ICs are designed to provide RF power, efficiency and gain in all current and proposed frequency bands, from 700 to 3,800MHz, with RF output power of 2.5 to 12W.

NXP Semiconductors has announced an expansion to its portfolio of 48V GaN RF power transistors optimised for Doherty power amplifiers for use in current and next-gen cellular base stations. The four new transistors collectively cover cellular bands from 1,805 to 3,600MHz, meeting the needs of wireless carriers for superior performance at higher frequencies.

Expanding its portfolio of broadband GaN RF power transistors for electronic warfare and battlefield radio applications, NXP Semiconductors has announced six driver or final-stage amplifiers that have frequency coverage as broad as 1 to 3,000MHz.

  A line of automotive power MOSFETs housed in a compact, thermally enhanced Loss Free PAcKage (LFPAK) has been introduced by NXP Semiconductors.

NXP Semiconductors N.V., a partner of the U.S. Department of Transportation’s (USDOT) Smart City Challenge, Siemens, and Cohda Wireless are demonstrating cutting edge technology for smart mobility this week in Austin, Texas, during NXP’s FTF Technology Forum. NXP and Siemens are hosting test rides in the smart city of Austin for a live experience of advanced connected mobility technologies, such as vehicle-to-vehicle (V2V) and vehicle...

NXP Semiconductors has expanded its best-in-class, low power and long range JN5169 wireless modules. The three wireless modules: JN5169_M00, JN5169_M05 and JN5169_M06, are pre-certified FCC/CE/IC and can be loaded with the latest NXP ZigBee 3.0 stack. The wireless modules with ZigBee 3.0 helps enable customers to rapidly introduce wireless products into the mass market faster. 

NXP Semiconductors and Wayv have unveiled the world’s first battery operated, handheld portable cooking appliance, the Wayv Adventurer. Designed to be compact, rugged and light-weight, the Wayv Adventurer is intended to give people the flexibility to efficiently and conveniently heat food anytime and anywhere.

In readiness for the next revolution in high speed home and small-business (SMB) broadband, NXP Semiconductors has introduced an expanded gateway platform scaling from 1Gbps at extreme low power, all the way to 20Gbps of bi-directional wireline/WiFi performance at the high end.

NXP Semiconductors has announced new solid state RF cooking modules to accompany its popular RF cooking components portfolio. The module is designed to help engineers rapidly build innovative RF cooking appliances that can achieve a better way of highly efficient, uniform heating, adaptability and consistency of the cooking process than conventional radiant or convection methods.

At NXP Semiconductor’s annual user conference, NXP FTF 2016, the company is showcasing new solutions to help engineers and developers create secure, smart, connected experiences. A key theme for the event is the future smart city, which presents a complex, multi-vertical opportunity for the IoT that crosses public and private sectors.

NXP Semiconductors expands its support for the electronic payments market by introducing a point-of-sale (POS) reader solution platform, SLN-POS-RDR, to enable customers to quickly develop and launch secure, contact and contactless payment systems into the market. The rapidly evolving market of electronic payments introduces new, innovative form factors, use cases and integration levels for the latest payment devices.

NXP Semiconductors has announced four new laterally diffused metal oxide semiconductor (LDMOS) RF power transistors that allow designers of solid-state cooking solutions to customise their products in both frequency and RF output power. They were designed exclusively to be used in cooking appliances and are incorporated within NXP's new solid-state RF cooking module.

NXP Semiconductors has introduced an innovative vertical integration technology called V-Link and will be demonstrating at the NXP Technology Forum the first product in the line-up which is based on the i.MX 6SoloX single chip module (SCM). The V-Link bus allows customers to customise their own system adding connectivity, sensing, and other innovative off-the-shelf solutions on top of the base SCM device through package-on-package assembly techno...

NXP Semiconductors has debuted the potential of secure, vivid and interactive interfaces powered by next gen i.MX 8 applications processors. NXP also introduced a multisensory enablement kit (MEK) based on i.MX 8, a multisensory processor family that promises to transform everyday interactions by advancing multimedia and display interfaces across demanding compute and media-intensive applications.

Marking a significant milestone in the fast-approaching self-driving vehicles era, NXP Semiconductors has demonstrated a comprehensive and highly manufacturable autonomous vehicles platform leveraging NXP’s BlueBox engine and deploying NXP silicon and software solutions at each ADAS node. The system demonstration incorporates the BlueBox central computing engine, together with radar, lidar, and vision sensing, as well as an onboard secure V...

Students from Haute Ecole ARC Ingénierie, Switzerland won the Grand Final of the NXP Cup EMEA Challenge 2016. They prevailed and won the race after a fierce competition that brought together the winners from regional rounds around Europe. The 16 teams were from universities and high schools in Germany, Switzerland, UK, France, Italy, Greece, Romania, Poland, Ukraine as well as Morocco.

Addressing the growing industry demand for a cost-effective, flexible and scalable platform architecture to enable existing and emerging LED lighting features, NXP Semiconductors has announced its multi-channel LED driver IC portfolio for automotive exterior lighting. The two families, the multiphase boost ASLx500 and multichannel buck ASLx416 driver ICs, are both based on NXP's automotive qualified ABCD9 technology - a platform for mixed-signal,...

NXP Semiconductors N.V. has introduced ICODE DNA to its family of ICODE products. As part of its continuing commitment to deliver secure identification solutions, NXP’s ICODE DNA enhances security for vicinity applications by enabling tag authentication and privacy protection based on cryptographic security. NXP will showcase its ICODE DNA device, with products and customer programmable originality signatures at RFID Journal Live, May 3-5th...

NXP Semiconductors has introduced what it claims to be the most powerful RF transistor in any technology operating at any frequency. Designed to deliver 1.50kW CW at 50V, the MRF1K50H can reduce the number of transistors in high-power RF amplifiers, which helps to reduce amplifier size and BoM.