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NEC Corporation

NEC Corporation Articles

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Design
31st March 2009
Cadence and NEC Announce Encounter Digital Implementation System To Support NEC's System LSI with Built-In V850 CPU Core

Cadence and NEC Electronics have announced the development of prototypes of NEC Electronics’ state-of-the-art V850 -based System LSI, made possible by support of Cadence’s new Encounter Digital Implementation System v8.1. NEC Electronics developed its LSIs next-generation CPU core, successfully reducing the total design turnaround time by fifty percent while including complete full multi mode, multi-corner analysis and optimization througho...

Micros
26th March 2009
NEC Electronics launches Two PLUG IT! Starter Kits

NEC Electronics Europe has announced the release of two Plug it! starter kits to evaluate Full Speed 12 Mbps USB 2.0 function and host communications implemented in its 32-bit V850ES/Jx3-H and V850ES/Jx3–U microcontroller range. V850ES/Jx3-H has Full Speed 12 Mbps USB 2.0 function capability whilst V850ES/Jx3–U incorporates both Full Speed 12 Mbps USB 2.0 host and function capabilities.

Analysis
23rd March 2009
NEC Electronics Europe Announces AUTOSAR Platform

NEC has announced that its microcontroller abstraction layer (MCAL) software for V850ES/Fx3 microcontrollers is integrated into a platform solution for door modules which Kostal GmbH & Co. KG will be launching. The focus for this project is to create a platform solution for door modules based on AUTOSAR standard software without compromising functionality or real-time and cost requirements. This objective will be achieved by combining Kostal’s ...

Micros
19th March 2009
NEC Electronics' latest Spin it! Development Kit is available

NEC Electronics has announced the release of its latest Spin it! development kit. The 78K0R – Spin it! is a single-board, low-voltage motor control development platform designed specifically for the evaluation of NEC Electronics’ 16-bit 78K0R/Ix3 Motor Control MCU family.

Power
17th March 2009
NEC Introduces Ultra-Thin New MOSFET Devices in a SOT-23F Package

NEC Electronics Europe has introduced four MOSFET products: N0100P, N0301P, N0302P, and N0301N all housed in SOT-23F package which is an ideal choice for space- and power critical applications of all kinds. The new MOSFETs are available now.

Pending
4th March 2009
NEC introduces SoC for Car Audio Systems

NEC Electronics today announced the sampling of a new system-on-a-chip (SoC) for car audio systems, the µPD35502. The new µPD35502 SoC increases the processing of music data to realize playback of multiple songs, multiple sources, and multiple destinations, allowing the flexibility to play different songs in the front and rear seat. To speed system development, a complete software package, including compressed audio decoding software (codecs) f...

Micros
3rd March 2009
NEC Electronics Announces 78K0R/Kx3-L Save it! Demonstration Kit

NEC Electronics Europe announces the release of the 78K0R/Kx3-L Save it! demonstration kit, supporting the recently launched 78K0R/Kx3-L microcontroller family that offers low power consumption and high levels of system integration. Save it! is designed to provide customers with a complete out-of-the-box experience for evaluation of low power consumption microcontrollers.

Micros
26th February 2009
NEC Electronics Announces FreeRTOS Support for its Micros

NEC Electronics Europe has announced the support of the open source and royalty free real-time operating system, FreeRTOS for its 16-bit 78K0R and 32-bit V850 microcontrollers. FreeRTOS is simple to use, with minimal ROM and RAM overhead and is free to use in commercial applications. The modified GPL license under which it is distributed, allows users to deploy in applications without any requirement to share their source code.

Power
24th February 2009
NEC introduces higher-performance DPAK package for PowerMOSFETs in automotive applications

NEC Electronics Europe has announced an expansion of its product offering of low-voltage PowerMOSFETs for automotive applications. A new package variant of the popular DPAK package for PowerMOSFETs features electrical properties that previously were provided only by the larger D2PAK (TO-263) package.

Micros
17th February 2009
NEC Electronics Expands lineup of 32-bit Microcontrollers

NEC has announced that it has developed nine new 32-bit All Flash microcontrollers (MCUs) with built-in Ethernet interface and embedded flash memory. The new products are ideal for remote and supervisory control of industrial devices and building-management systems and include six 128-pin variants, named V850ES/JH3-E and three 144-pin variants, named V850ES/JJ3-E.

Power
16th February 2009
NEC announces HSON-8 package for PowerMOSFETs in automotive applications

NEC Electronics Europe today announced the availability of a new package variant, HSON-8, for low-voltage PowerMOSFETs in automotive applications. The 6.0 mm x 5.2 mm x 1.45 mm HSON-8 package has the same footprint as an SOP-8 package. Compared with a DPAK (TO-252), this reduces mounting space by half, while maintaining the excellent thermal and electrical properties of DPAK packages.

Pending
9th February 2009
NEC introduces PowerMOSFET technology for fast switching of high currents

NEC Electronics Europe has announced an expansion of its low-voltage PowerMOSFETs product offering. Based on NEC Electronics’ SuperJunction1 technology, the new products feature an outstanding figure of merit (FOM) and thus minimize switching losses and increase system efficiency.

Pending
6th February 2009
SoC from NEC enables camera-equipped mobile phones to give great images

NEC Electronics has introduced a SoC product that enables camera-equipped mobile phones to provide clear and high-quality images comparable to digital still cameras (DSCs). The new product offers mobile phones to output Full-HD (1080p) video stream and still image data up to 12 Megapixels retrieved by the CMOS sensor. In addition, CE143 also incorporates proven, state-of-the-art image stabilizing and optical compensation technologies that can be ...

Displays
6th February 2009
NEC to Provide 3D TFT LCD Module Samples for EU’s “MOBILE3DTV” Terminal Prototype

NEC LCD Technologies has announced that it will provide samples of its 3.1-inch-diagonal 3D polysilicon thin-film-transistor (TFT) liquid crystal display (LCD) module for the MOBILE3DTV terminal prototype. The MOBILE3DTV prototype will be on public display at the Mobile World Congress 2009 (MWC2009), the world’s largest mobile technologies-related event, in Barcelona February 16–19.

Pending
5th February 2009
NEC Electronics Sharpens Image Quality with Super-Resolution ASSP

NEC Electronics today introduced a new application-specific standard product (ASSP) based on the company's unique single-frame super-resolution technology which reduces the blurring that occurs when low-resolution images are expanded and displayed in high-resolution. The ASSP sharpens out-of-focus images, smoothes rough edges and refines contours by analyzing and processing information contained in one frame of data in real time. Using standard v...

Design
2nd February 2009
NEC Unveils a Complete Set-Top Box Reference Design

NEC Electronics Europe has announced the availability of a complete cost and power consumption optimized manufacturer’s kit based on NEC Electronics’ EMMA3SL/LP MPEG-4 digital TV processor which drastically reduces the time to market of MPEG-4 standard definition set-top box.

Displays
26th January 2009
NEC LCD Technologies Introduces New Lineup of TFT LCD Modules

NEC LCD Technologies has introduced two new amorphous-silicon thin-film-transistor (TFT) liquid crystal display (LCD) modules incorporating white LED backlights for industrial applications. The modules consume less power, are substantially thinner and lighter than comparable LCD modules incorporating cold-cathode fluorescent lamp (CCFL) backlights.

Wireless Microsite
19th January 2009
NEC's EMMA Mobile 1 System LSI for Portable A/V Devices

NEC Electronics has announced that it has commercialized EMMA Mobile 1, an optimal system LSI chip for the market of portable devices to process audio and visual data, such as portable multi-media players and mobile TVs. Samples of the new EMMA Mobile 1 are available now.

Wireless
19th January 2009
NEC's EMMA Mobile 1 System LSI for Portable A/V Devices

NEC Electronics has announced that it has commercialized EMMA Mobile 1, an optimal system LSI chip for the market of portable devices to process audio and visual data, such as portable multi-media players and mobile TVs. Samples of the new EMMA Mobile 1 are available now.

Analysis
19th January 2009
NEC Electronics Introduces System LSI Chips for Set-Top Boxes

NEC Electronics has introduced the EMMA3SL/LP and EMMA3SL/L which are third generation ‘Enhanced Multi-Media Architecture’ (EMMA) set-top box devices specifically targeting MPEG-4 standard definition (SD) the next-generation image compression standard expected to become popular in Eastern Europe, Russia & CIS, India, South Africa, and other emerging nations adopting digital television.

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