Offering ultra-low power consumption, a rich peripheral interface, an integrated IoT cybersecurity platform, and a power MCU core for user applications. The 2EG wireless module provides a 7mm x 7.4mm x 1mm LGA package, 48MHz Arm Cortex M33, onboard antenna and external antenna options, and various I/O interfaces such as UART, QSPI, SPI, GPIO, ADC, DAC, PWM, and I2C.

Murata is pleased to announce its partnership with MobileKnowledge, combining Ultra-wideband (UWB) expertise with a range of comprehensive products and in-depth customer support.

On the 15 June 2023 the University of Parma, in conjunction with Murata ID Solutions and Zebra Technologies, presented the results of their latest RFID sustainability research project.

At embedded world 2023, on the Digi-Key booth, Paige West speaks with Suman Thapa, Product Engineer for Connectivity Modules (LPWA) at Murata Electronics about cellular IoT and Murata’s Type 1SE module.

Electronics manufacturer Murata announces the introduction of the DLW32PH122XK2 wire wound chip common mode choke coil.

Murata and Skylo will demonstrate the next-gen of cellular and satellite services at Mobile World Congress.

Underlining its expertise in developing low-power wireless hardware, specialist electronics manufacturer Murata will have its latest product innovations on display at embedded world.

Murata is fully prepared to participate in this year’s Electronica (15 – 18 November 2022) – as the international electronic engineering community returns to Munich Messe once again, after a longer than expected absence.

Murata has introduced the BLE32SN series of chip ferrite beads. These are the world’s first chip-type noise suppression components to have 20A current rating.

Murata announces the MRD series of open-loop current sensors for industrial systems. Each integrates high-performance tunnel magneto-resistive (TMR) elements – enabling precision measurement with regard to both DC and AC currents up to 40A, as well as maintaining stable characteristics across an extensive temperature range.

At embedded world 2022, on the Digi-Key booth, Paige West speaks with Shohei Kawanaka, Product Manager for Connectivity Modules (LPWA), Murata Electronics about LoRaWaN and Murata’s Type ISJ module.

Murata has designed and manufactured the Abeeway-Murata Geolocation Module (LBEU5ZZ1WL) co-developed with Abeeway, an Actility Group company.

Murata and technology partner Pycom continue to progress with their shared goal of making IoT implementation quicker and easier.

Murata has introduced an accurate three-in-one soil sensor for data-driven sustainable agriculture.

Murata will introduce the small RAIN RFID Tag at Pharmapack Europe (Stand C20), 18-19 May 2022.

Murata has entered into a technology partnership with antenna manufacturer Ignion. This will see Murata components used as a foundation for development using Ignion’s Antenna Intelligence Cloud.

pSemi Corporation, a Murata company focused on semiconductor integration, expands its portfolio of RF SOI switches targeted for the latest 5G wireless infrastructure and massive MIMO base station deployments. By using the new high linearity switches in hybrid architecture topologies, base station designers can save valuable board space and improve thermal management, reducing the overall system's cost, weight and power consumption. pSem...

Murata has co-developed a generation of RFID modules with Michelin that embed into tyres. The robust passive RFID tags require no external power supply. 

Murata has announced the availability of its MGJ2 series, a new line of surface mount DC-DC converters. Comprised of six models, the lightweight units each have a 2 W power rating and are supplied in compact, low-profile form factor modules measuring just 19.49mm x 14.99mm x 4.39mm dimensions. Available in 12 V and 15 V voltage rails, they feature +15V/-5V, +15V/-9V, and +20V/-5V bipolar outputs. They are intended to accompany the IGBT ...

Murata has extended its product offering for the mobile and High-Performance Computing (HPC) markets with the availability of its latest silicon process technology to fabricate silicon capacitors with a density of 1.3 µF/mm².