Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. 

According to Master Bond, EP29LPAO is a cost effective, two part system with a low viscosity, excellent flow properties and heat dissipation properties. Featuring convenient processing, this epoxy has a forgiving 100 to 50 mix ratio by weight and a pot life of 7-9 hours at room temperature for a 100 gram mass. 

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries.

Master Bond EP113 is a nanosilica filled epoxy that is said to deliver enhanced dimensional stability and exceptionally low shrinkage upon curing. This optically clear, two component system is well suited for applications in the aerospace, electronic and OEM industries.

Master Bond MasterSil 910Med is a one part acetoxy type silicone system that meets USP Class VI specifications for biocompatibility and ISO 10993-5 testing for cytotoxicity. This translucent paste also withstands many sterilisation methods, including liquid sterilants, gamma radiation and EtO.

Master Bond Supreme 45HTQ-4 is a toughened epoxy for high performance bonding, sealing, coating and casting and can be used for a wide variety of industrial, aerospace, OEM and oil processing applications, especially in downhole situations.

Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature. 

Master Bond UV15X-6NM-2 is a one component UV curing urethane acrylate system and will be widely used for fiber-optic, optical, electronic, semiconductor, microelectronic and laser applications. It is formulated for a variety of bonding, sealing, coating and encapsulation applications.

Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers which can be applied in bond lines as thin as 10-15 microns while offering an exceptionally low thermal resistance.

Developed for high performance bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is already selected by the aerospace, electronics and specialty OEM industries. It combines easy processing with a profile that includes high physical strength.

Master Bond MasterSil 972TC-LO passes the requirements for low outgassing to ASTM E595 specifications and is particularly well suited for use in vacuum environments as well as applications in the aerospace, electronic, opto-electronic and specialty OEM industries.

Master Bond UV15DC80Med has a dual curing mechanism which employs UV light followed by heat to complete the polymerization. This allows for curing areas on parts that do not allow UV light curing because of “shadowing” issues. This kind of UV system is highly desirable because it allows for rapid fixturing with completion of the cure accomplished by adding heat.

Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. Cures can be accelerated at higher temperatures

With enhanced chemical resistance Master Bond MasterSil 930 is an acetoxy type fluorosilicone for bonding, sealing and coating applications in aerospace, electronics, specialty OEM and other industries. This one part system is able to withstand exposure to water, fuels, oils, greases, refrigerants, acids, bases and solvents better than standard silicones.

Master Bond EP21NDCL is a unique two component epoxy system that cures optically clear in thin sections, even though Part A is translucent and Part B is light amber. This non-drip compound is formulated for a variety of bonding, sealing and coating applications in the optical, opto-electronic, electrical, aerospace and specialty OEM industries.

Developed for a variety of bonding, sealing, potting and encapsulation applications, Master Bond's EP3RR-80 is a one component epoxy that offers user friendly handling with a moderate viscosity, good flow properties and an unlimited working life at ambient temperatures. The epoxy system can be stored at 4.5-10°C and does not require freezing.

Widely used for applications in the aerospace, electronic and OEM industries, Master Bond EP121CL-LO is a high performance epoxy that passes ASTM E595 testing for NASA low outgassing specifications. This two component system has a low mixed viscosity of 1,000-3,000cps with a mix ratio of 100:80 by weight. It features an exceptionally long open time of at least 2-3 days at room temperature in a 100g batch and requires oven curing.

Designed for high performance structural bonding in the aerospace and speciality OEM industries, Master Bond has announced the EP13SPND-2 one part, high temperature resistant epoxy. Featuring an impressive strength profile, EP13SPND-2 offers a tensile lap shear strength, compressive strength and tensile modulus of over 3,000, 18,000 and 500,000-550,000psi.

Designed for high performance bonding, sealing and coating applications for medical devices, MasterSil 912Med is a room temperature vulcanising silicone system. This system meets both USP biocompatibility and ISO cytotoxicity standards and resists a variety of sterilisation techniques such as gamma radiation, EtO and some types of liquid sterilants.

An electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 1.30-1.44 W/(m·K) has been introduced by Master Bond. As a polysulfide based system, the EP21TPFL-1AO has very good chemical resistance, particularly to fuels, oils, hydraulic fluids and related compounds. This unusual blend of properties makes the system suitable for a variety of bonding, sealing, coating and encapsulation applications in the elec...