Infineon has introduced the CoolSiC Schottky diode 2000V G5, the first discrete silicon carbide diode on the market with a breakdown voltage of 2000V.

Infineon Technologies’ IGC033S10S1 has been shortlisted for the Electronics Excellence Awards under the Power Product category.

Infineon Technologies is paving the way to a significant reduction of plastic waste and CO2 emissions in the payment card industry. The company has announced the launch of SECORA Pay Green which enables card designs allowing production of the world’s first fully recyclable contactless (dual-interface) payment card bodies based on environmentally friendly and locally sourced materials.

Infineon is introducing the HybridPACK Drive G2 Fusion, establishing a new power module standard for traction inverters in the e-mobility sector.

Infineon has introduced the Automotive PSoC Multitouch GEN8XL (IAAT818X), a new generation of touch controllers.

Infineon hosted its first-ever Supplier Sustainability Summit to further stimulate collaboration and incentivise and support suppliers to accelerate their decarbonisation journeys. The virtual event brought together about 100 top semiconductor industry suppliers.

Data centres currently account for over 2% of global energy consumption. With the rise of AI, this figure is predicted to increase to as much as 7% by 2030, which would be equivalent to the current energy consumption of India. 

Infineon Technologies announced a partnership with Canada-based AWL-Electricity Inc., a pioneer in MHz resonant capacitive coupling power transfer technology.

In battery-powered applications such as motor drives and switched-mode power supplies (SMPS), the power supply architecture often requires that a module can be disconnected from the main supply rail when a fault occurs in that module.

Infineon has announced the addition of the EZ-USB FX20 programmable USB peripheral controller to its EZ-USB product family.

Infineon has expanded its OptiMOS 6 MOSFET portfolio with the new 135V and 150V product families.

Infineon Technologies, in collaboration with its technology partner Oxford Ionics Ltd., has been selected as part of a consortium to develop a mobile quantum computer.

In order to further drive decarbonisation, improving the energy efficiency of buildings is crucial, as they contribute significantly to global energy consumption and carbon emissions.

Infineon has announced SECORA Pay Bio, an all-in-one biometric payment card solution that complies with Visa and Mastercard specifications.

Infineon has received the “ASCM Award of Excellence – Corporate Transformation” from the Association for Supply Chain Management (ASCM).

ZF and Infineon have jointly developed and implemented AI algorithms for the development and control of vehicle software as part of the EEmotion project.

Infineon Technologies introduces its new StrongIRFET 2 power MOSFET 30V portfolio, expanding the existing StrongIRFET 2 family to address the growing demand for 30V solutions in the mass market segment.

Infineon has announced that the company has succeeded in developing the world’s first 300mm power GaN wafer technology.

Roborock, a global pioneer in intelligent home robotics, has launched the intelligent sweeping and mopping all-in-one robot Roborock Qrevo Slim at IFA 2024 in Berlin, equipped with a 3D camera module for navigation and obstacle avoidance using the REAL3 Time-of-Flight (ToF) imager by Infineon Technologies.

Infineon has announced the expansion of its Bluetooth portfolio by eight new products in the AIROC CYW20829 Bluetooth Low Energy 5.4 MCU family, featuring Systems-on-Chip (SoCs) and modules optimised for industrial, consumer, and automotive use cases.