Indium Corporation will feature its Indium10.1 and Indium8.9HF solder pastesat NEPCON South China (Aug 30-Sept 1). The company has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved finished goods reliability.

Indium Corporation's indium metal and indium alloy reclaim and recycle program earns customers an enhanced return on used materials. Indium is used extensively in thermal management, low-temperature soldering, and sealing applications and, in many instances, the indium is not fully consumed and can be reclaimed from the process. 

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will chair the professional development course, Materials Considerations for Achieving High Reliability Lead-Free Soldering, at the Electronic Components and Technology Conference (ECTC), on May 31-June 3 in Las Vegas.

According to Indium Corporation, its germanium reclaim and recycle program enables customers to increase their return on materials by providing credit for diverting spent germanium from the waste stream. Germanium, used in things like the production of fiber optic cables, optical lenses and wafers, and catalysts in polyethylene (plastic) production, is typically not completely consumed during the process.

Dr. Lee’s webtorial, Low-Temperature Solders: New Developments and Applications, will cover varieties of low-temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and their applications. It will take place from 1-2 p.m. on May 17 and 19.

Kenneth Thum, Senior Technical Support Engineer at Indium Corporation will present Risk of No-Clean Flux Not Fully Dried Under ComponentTerminations at IPC Thailand on April 26 in Bangkok, Thailand.  Thum’s presentation will discuss a new halogen-free, no-clean SAC solder paste that has been developed to Avoid the Void and to address the reliability issues caused by insufficiently dried or burnt-off flux residue.

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany. The Indium8.9HF Series is specifically formulated to Avoid the Void while delivering high transfer efficiency with low variability. 

Indium Corp has released Indium10.2HF, a halogen and Pb-free, no-clean solder paste that has been specifically formulated to address in-circuit testing challenges. Indium10.2HF is said to provide low cost-of-ownership to PCB assemblers through all-around balanced performance. 

Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors. In addition to its resistance to non-wet opens, Indium10.8HF also delivers a superior oxidation barrier. 

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg.

Indium Corp says manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs and will help customers Avoid the VoiD with its void-reducing no-clean solder pastes at IPC APEX Expo.

Indium Corporation will be all over APEX with plans to run its low-voiding solder products “Live@APEX” program in partner booths throughout the show in Las Vegas. “Live@APEX,”  is designed to accurately depict the performance of the company’s materials in real time. The program places Indium Corporation products into live equipment demonstrations around the APEX show floor.

Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China. Lim’s presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process.

Indium Corporation has announced the release of PoP Flux 89LV-P, a bright pink-colored, no-clean, thixotropic flux that helps engineers to Avoid the Void by greatly improving visual inspection to minimize voiding and other defects in package-on-package applications.

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas.

Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void, while delivering high transfer efficiency with low variability.

Indium Corp will feature Heat-Spring, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara.  Heat-Spring is an interface that provides 86 W/mK of thermal conductivity using a pressure range of only 35-100+ psi.

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void at IPC APEX Expo, which will be held on March 15-17 in Las Vegas.

Indium Corp is to feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016 which takes place Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications such as aerospace, defence, and medical.

Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS at NEPCON Japan. InFORMS are high-reliability solder preforms that provide a consistent bondline thickness to maximize thermal and mechanical reliability.