Fujipoly America Corp.
- 900 Milik Street
P.O. Box 119
Carteret,
NJ
07008-0119
United States of America - 732.969.0100
- http://www.fujipoly.com
- 732.969.3311
Fujipoly America Corp. Articles
Compound exhibits a thermal conductivity of 2.6W/m°K
Fujipoly has announced an easy-to-apply, thermally conductive and electrically non-conductive silicone-based compound which exhibits a low thermal resistance. Sarcon SG-26SL delivers a thermal conductivity of 2.6W/m°K when dispensed between a component such as a CPU or power converter and a heat sink.
Reinforced nylon mesh prevents die-cut hole collapse
Fujipoly’s Sarcon 250G-HF2d thermal interface material is manufactured with a reinforced nylon mesh inner layer and a low-tac surface treatment. This prevent die-cut holes from collapsing and help maintain original specification tolerances during final assembly. These material enhancements also reduce tearing, elongation and damage making your production operations faster and easier.
Connector suits devices with pad spacing as close as 0.50mm
Providing a reliable and cost-effective way to connect an LCD to a PCB, the Zebra elastomeric connector has been released by Fujipoly. When positioned between a PCB and LCD, the connector makes redundant electrical contact using 140 conductive pads per inch.
Cost-effectively transfer heat away from components
Die-cut thermal interface gaskets from Fujipoly are a cost-effective and easy way to transfer heat from electronic components to the surrounding environment. When placed between a heat source and a heatsink, the gaskets conform to all uneven surfaces and fill any air gaps. This significantly increases surface contact with the heatsink thereby increasing cooling efficiency.
Thermal interface material offers 2.5W/m°K conductivity
Manufactured in a versatile sheet form to be die cut or trimmed to perfectly fit application requirements, the Sarcon PG25A thermal interface material has been introduced by Fujipoly. The extremely soft, gel like compound provides a thermal conductivity of 2.5W/m°K with a thermal resistance of 0.24-1.7°Cin2/W, depending on sheet thickness and compression.
Material delivers thermal conductivity of 2.1W/m°K
The SARCON SPG-15A, a form-in-place thermal interface compound from Fujipoly, has been updated. The easy to dispense SARCON SPG-20B, is a low-viscosity thermally conductive silicone that delivers a thermal conductivity of 2.1W/m°K and a thermal resistance of 1.8°Cm2/W.
Connectors reduce assembly time & cost for LGA applications
Reducing assembly time and cost for a variety of land grid array (LGA) applications, Fujipoly has introduced the W series matrix connectors. Delivering measurable cost savings for densely packed boards with 200 or more I/Os, the silicone-based connectors eliminate the need to solder the LGA to the PCB.
Conformable TIM offers thermal conductivity of 11 W/m°K
The introduction of a 1.0 mm thick sheet signals an expansion of Fujipoly’s Sarcon XR-Pe product offering. Conforming to most CPU and semiconductor shapes, the material offers thermal conductivity of 11 W/m°K (ASTM D 5470) with a thermal resistance as low as .06°Cin2/W.
And the Winner Is…
Over the last several weeks, hundreds of engineers and industry professionals entered Fujipoly’s Great Gift Giveaway by filling out an online entry form that asked participants to simply name one of the Company’s products. Today, we are happy to announce thatHenry Bui an Engineer with NCR Corp. in Duluth, GA is this year’s winner. His favorite product line is Fujipoly’s Zebra Elastomeric Connectors.
Fujipoly Thermal Gel Sheets A Cooling Influence on LED Lighting
Over the last several years hundreds of major electronics manufacturers have expanded their use of LED lighting to enhance both product appearance and functionality. Recent design trends have integrated LED lighting packages in thousands of consumer and industrial electronic platforms that range from aircraft landing systems to automotive headlights and complex industrial control panels.
Low Resistance Gold Plated Connector
Fujipoly America is pleased to announce the Zebra Gold Series 8000B, a high performance, low resistance connector that is capable of transferring both data and power between parallel components or circuit boards.