As the LED lighting market continues to grow, designers need solutions that meet limited circuit board footprints, meet circuit protection and system reliability demands, and simplify supply chain logistics, all while maintaining global energy regulation compliance. To help designers meet these requirements, Fairchild Semiconductor expanded its LED lighting driver solutions portfolio to include an optimized low-power offering.

Fairchild Semiconductor offers a substantial portfolio of power, analog, and mixed-signal solutions with advanced process and packaging technologies. With a focus on mobile innovation, Fairchild will showcase these offerings at the Portable Innovate Exhibition, July 25-26, 2012, in booth 3B21 at the Shenzhen Convention & Exhibition Center, China.

As consumers become more dependent on their electronic devices and manufacturers continue to increase the functionality of their end-application, there is an inherent risk that a simple error, such as incorrectly plugging in the device or a common electrical event, like electrostatic discharge or lightning, will result in a system failure. This in turn can lead to product returns, lawsuits, expensive recalls, lost revenues, decreased personal pro...

As mobile system design cycles shorten, being able to verify product success in a timely manner is a crucial step in the process. Designing and manufacturing products right the first time shortens time-to-market and can give the competitive edge needed to capture market share.

Switch mode power supply designers need space-saving, cost- effective power supply solutions with high energy efficiency, optimized system performance and improved reliability. To help meet these design complexity challenges, Fairchild Semiconductor has developed the FSL206MRx integrated Pulse-Width Modulator controller.

In order to meet demanding emissions and high fuel efficiency requirements in present and emerging ignition systems, automotive designers need higher performance ignition coil driver technology. To help designers meet these requirements, Fairchild Semiconductor has introduced the latest generation of ignition IGBTs that provide reduced power dissipation in a smaller footprint. The EcoSPARK 2, FGD3040G2 and FDG3440G2 ignition coil drivers, deliver...

As technology becomes more advanced, consumers are conducting more of their business and personal lives on mobile devices. With so much infrastructure being built into these devices, having simple solutions that resolve system freezes quickly is critical. Fairchild Semiconductor's newly expanded line of reset timers provide a better solution for mobile device lock ups and freezes.

Fairchild Semiconductor will join experts from industry and academia in presenting papers on the latest developments and the future trends in power electronics at The Power Conversion, Intelligent Motion (PCIM) China Conference to be held at the Shanghai World Exhibition and Convention Center from June 19-21, 2012.

Designers of mobile devices are challenged to save space, increase efficiency and manage thermal issues in their end applications. To address this continuing trend, Fairchild Semiconductor developed the FDZ661PZ and FDZ663P P-channel, 1.5V specified PowerTrench® Thin 0.8mm x 0.8mm WL-CSP MOSFETs.

As power requirements increase to provide more functionality in high-density embedded DC-DC power supplies, power engineers are challenged with providing higher power density and efficiency in less board space. Fairchild Semiconductor helps designers meet this system challenge with the introduction of the FDPC8011S, a 25V, 3.3x3.3mm2, low-profile Dual Power Clip Asymmetric N-Channel Module.

Fairchild Semiconductor today announced it has filed new patent infringement claims against Power Integrations’ LinkSwitch-PH LED power conversion products.

Power Stage Dual Asymmetric MOSFETs incorporate a control FET and synchronous FET with a monolithic Schottky body diode in a single PQFN package. Applications include notebooks, point-of-load, servers, gaming devices, and telecommunications.

High power industrial applications such as solar inverters, uninterruptible power supplies (UPS) and motor drives demand a gate driver optocoupler capable of handling networks greater than 690VAC and constant DC voltages greater than1000VDC. In order to achieve this, a creepage and clearance distance of 10mm or greater is essential.

Fairchild Semiconductor has developed a smart high-side switch family that specifically addresses advanced electrical load control in automotive body electronics. The family provides an alternative to discrete MOSFET solutions, integrating protection and diagnostic features in order to reduce component count and PCB complexity, while offering better system reliability.

Fairchild Semiconductor announced that a jury in the U.S. District Court for the District of Delaware found Power Integrations, Inc. infringes a Fairchild U.S. patent covering primary side regulation. Power Integrations products found to infringe include certain LinkSwitch II and LinkSwitch-CV products, including the LNK603-606/613-616, SC1092, SC1097-99, SC1103, LNK632DG and LNK623-626. The same jury also found all asserted Fairchild patents val...

Driven by power efficiency standards and end-system requirements, power supply designers need energy efficient solutions that help shrink their applications power supply form factor without compromising power density. Fairchild Semiconductor’s FDMC8010 30V Power 33 MOSFET meets these needs by delivering best-in-class power density and low conduction loss in a 3.3mm x 3.3mm PQFN form factor.

New energy standards, combined with new system specifications for blade servers, high performance notebooks, gaming consoles and POL modules, are driving the requirements for better efficiency, higher current, higher switching frequency and increased power density. To meet these industry trends, Fairchild Semiconductor has developed the FDMF68xx Gen III DrMOS multi-chip module (MCM) family.

Fairchild Semiconductor Corp and Infineon Technologies AG today announced a licensing agreement on Infineon’s advanced automotive MOSFET packaging technology H-PSOF (Heatsink Plastic Small Outline Flat Lead), a JEDEC standard TO-Leadless (TO-LL) package (MO-299).

Engineers in the automotive space are faced with the challenges of delivering inverter designs with increased efficiency, higher drive current and greater immunity to noise, especially in hybrid electric vehicles (HEV) and electric vehicles (EV). To help designers meet these challenges, Fairchild Semiconductor, a leading global supplier of high performance power and mobile products, developed the FAN7171 high-current, high-side gate driver IC and...

Fairchild Semiconductor will demonstrate innovative power solutions for real success at PCIM Europe 2012, 08-10 May, in Hall 12, booth 601, in Nuremberg, Germany.