Engineered Materials Systems has introduced the EMS 561-147-2, a low-cost snap cure conductive adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. The adhesive is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.

Curing in 30 minutes at 80°C, three minutes at 100°C or 10 seconds at 150°C with an electrical conductivity of 4 x 10-5Ωcm, Engineered Material Systems' latest conductive adhesive, CA-180, is designed for die attach and general circuit assembly applications. CA-180 is suitable for temperature-sensitive applications, as well as those which require high conductivity interconnects.

  Engineered Materials Systems will exhibit in Booth #202 at ECTC 2015, scheduled to take place 26th to 29th May, 2015 in San Diego. Company representatives will showcase its DF-3000 series Negative Film Photoresists. The DF-3000 series is available in various thickness formats from 5-50µm, ±5%.

Engineered Material Systems is pleased to debut its 535-11M-7 UV cured epoxy, which has been developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications. The non-conductive UV cured adhesive is low outgassing,flexible, high strength and does not contain antimony and cures rapidly when exposed to high intensity UV light.

Engineered Material Systems has introduced the DB-1541-S9 conductive adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. The adhesive is stress absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to cell and ribbon metallisation during damp heat exposure.

An ultra-low stress, lower glass transition temperature version of the 535-10M-1 UV cure adhesive, Engineered Material Systems has announced the 535-11M-3. The UV cured epoxy was developed to meet the rigorous reliability requirements of disk drive, camera module, photonics and circuit assembly applications.

Engineered Material Systems is pleased to introduce the DF-3020 dry-film negative photo resist for use in Micro Electro Mechanical Systems (MEMS) and wafer-level packaging applications (TSV sealing). This material formulation has been optimised for hot roll lamination and processing on MEMS and IC wafers.

Engineered Material Systems is a sponsor for the Back Contact Workshop in Amsterdam (Nov 13/14). The workshop is an annual event hosted by The Energy Center of The Netherlands (ECN) and The Fraunhofer (ISE) Institute.

Photovoltaic technology supplier Formula E s.r.l. has entered into an agreement with Engineered Materials Systems for the development of electrically conductive adhesives. These adhesives will be used on  Formula E automated manufacturing lines.

The CI-1062 Conductive Silver Ink, for circuitry fabrication on wearable substrates, has been launched by Engineered Material Systems.

  Formulated for disk drive, camera module, optoelectronic and circuit assembly applications, Engineered Material Systems has announced the 535-10M-49 UV cured epoxy adhesive. The material contains a secondary thermal cure initiator that cures as low as 110°C for shadowed areas.

Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.

  Designed specifically to provide high reliability to the gold stud bump interconnects used in flip chip packaging, the 585-1 Non-Conductive Paste (NCP) has been introduced by Engineered Material Systems.

Engineered Material Systems debuts its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.

Engineered Materials Systems will exhibit in Booth #853 at the upcoming Assembly & Automation Technology Expo, scheduled to take place September 20-22, 2011 at McCormick Place North in Chicago, IL.