congatec has announced Intel Celeron Dual-Core processors with 3rd Generation Intel Core technology for the conga-TS77 (type 6) and conga-BS77 (type 2) COM Express modules. The modules provide impressive performance and improved energy efficiency at a low price point. The modules come with the new mobile Intel HM76 Express Chipset, offers up to 16GB of dual-channel DDR3 memory (1600 MT/s) plus direct support for USB 3.0 and Intel Hyper-Threading ...

congatec has been ranked the 22nd fastest growing technology company in Germany in this year’s Deloitte Technology Fast 50 awards. Rankings are based on the percentage of revenue growth over the last five years, 2007-2011. congatec achieved a growth of 293 percent during this period.

congatec has concluded the third fiscal quarter of 2012 with record results. Sales rose to €16.7 million, corresponding to an increase of 43% compared with Q3/2011. congatec’s growth is not limited to financial performance; the number of employees has also increased by 11 in the current year, bringing the worldwide total to 135.

congatec AG introduces a new reference board for video wall system design. Video wall systems increasingly rely on high-quality videos and (3D) graphics and therefore require a maximum number of graphics interfaces. The congatec reference board offers up to nine independent DisplayPort connectors in combination with an MXM graphics module and a COM Express CPU module.

congatec AG demonstrates the broad scalability of its modules for 3rd generation Intel Core on the COM Express standard. Offering a choice of three module versions, congatec now provides maximum graphics and processing power for both Type 2 and Type 6 Pin-out.

congatec has entered into partnership with Adeneo Embedded to deliver ready-to-use board support packages for the Freescale ARM Cortex A9 i.MX 6 Series based modules. Thanks to this new software partnership, congatec’s worldwide customer base can now benefit from a cost-effective end-to-end solution enabling them to speed up the development of Windows Embedded and embedded Linux devices.

congatec has introduced a new Qseven Starter Kit providing developers with a complete package to rapidly prototype embedded systems for ARM designs. Thanks to their compact size and extremely low power, Qseven embedded computer modules based on ARM architectures are an ideal solution for virtually any low-power or ultra mobile embedded PC application.

congatec sets another milestone offering support of the AMD Embedded R-Series platform with the new conga-TFS COM Express module based on Type 6 pinout. The integration of AMD Embedded R-Series APU expands the COM Express standard with a new module that combines power efficient high-performance x86 processing, unprecedented integrated graphics performance and high performance parallel processing support.

congatec AG is widening its sales presence in Australia and New Zealand with the opening of a new subsidiary in Queensland. Following on the heels of last month’s office opening in Japan, congatec is now directly represented with six offices on four continents – Asia, Australia, Europe and North America.

congatec AG announced that it has officially opened a Japanese subsidiary in Tokyo on 1 July 2012. Eric Hsu has been appointed as office manager of congatec Japan Ltd. Japan is one of congatec’s most important markets in Asia.

congatec has today announced the addition of the conga-BP77 to its portfolio of 3rd generation Intel Core modules. This version is based on the COM Express Type 2 connector pin-out and supports the PCI Express graphics port for high-performance external graphics.

congatec AG has succeeded in posting sales for FY 2011 of €47.7 million. Compared with turnover for 2010, this represents an increase of around 4.2%, even though the year was economically hard and characterised by upward and downward trends in the market. The profit on sales halved accordingly, to 1.3% (previous year: 2.6%).

congatec AG releases the conga-TS77 which supports the latest 3rd generation Intel Core processor variants and the new Mobile Intel QM77 chipset. The Type 6 COM Express module offers more performance, improved energy efficiency, greater security thanks to Intel VT and optional Intel AMT 8.0 support.

A group of embedded computing manufacturers have formed a registered association to drive standardization of embedded computing technologies called The Standardization Group for Embedded Technologies e.V. The proclaimed aim of the association is to speed up the development of new standards for embedded hardware and software. 23 companies signed up to support the founding principles during the inaugural meeting, among them Advantech, congatec, Dat...

congatec AG sets another milestone offering support of the AMD Embedded R-Series platform with the new conga-TFS COM Express module based on Type 6 pinout. The integration of AMD Embedded R-Series APU expands the COM Express standard with a new module that combines power efficient high-performance x86 processing, unprecedented integrated graphics performance and high performance parallel processing support.

congatec AG has just introduced conga-TM77, a new module with a significant improvement in computing performance combined with enhanced energy efficiency. The crucial innovations in the 3rd generation Intel Core processors relate to the construction, with 3D Tri-Gate transistors and 22 nanometer technology, plus a more powerful integrated graphics core. The type 6 pinout and 3x digital display interfaces provide better display options and increas...

congatec AG announces the conga-TCA, an entry-level model of its Type 6 Pin-out COM Express module range. The conga-TCA is available in three variants of the new Intel Atom dual-core processor generation, which are manufactured in 32nm technology – the Intel Atom N2600 processor with only 3.5W TDP (1M Cache, 1.6 GHz); the Intel Atom N2800 processor (1M Cache, 1.86 GHz) with 6.5W TDP; and the Intel Atom D2700 processor (1M Cache, 2.13 GHz) with ...

congatec AG supports OpenCL (Open Computing Language) for its Computer-on-Modules (COMs) with AMD Fusion technology across the popular module standards ETX, XTX, COM Express and Qseven. OpenCL is an Application Programming Interface (API), which enables developers to take full advantage of the high performance graphics cores of AMD’s Accelerated Processing Unit (APU) for a variety of non-graphical computing tasks

congatec AG announces the conga-TS67, a new low-power module for advanced designs. It supports Pin-out Type 6 and provides improved display options along with increased bandwidth thanks to digital display interfaces and additional PCI Express lanes. With new, super low-power Intel processors soldered on in a BGA package, the module is suitable for vibration-resistant applications.

congatec AG is set to expand its product portfolio with the addition of ARM technology. This will allow the company to offer products with extremely low power requirements in the future. As a first step in that direction, congatec is expanding its Qseven product family with Freescale processors. Up until now, congatec has focused exclusively on x86-based COMs (Computer-on Modules). As part of its new product strategy, the company now plans to ...