‘Headless’ CoM suits deeply embedded IoT applications

The module provides high density data processing and low power consumption, with a maximum TDP of 3W. Thanks to the extremely low power consumption, design effort is significantly reduced and maintenance-free.

A space-saving single-chip processor makes the module suitable for fanless designs in connected device IoT applications. These include, for example, M2M and motion control applications for industry 4.0, gateways, or system and control monitoring in smart home automation.

The Qseven module comes with 2GB of DDR3L memory and up to 16GB eMMC 4.5 for mass storage. Thanks to native USB 3.0 support, the module achieves fast data rates with low power consumption. A total of six USB 2.0 ports are provided, one of which supports USB 3.0 SuperSpeed.

Three PCI Express 2.0 lanes and two SATA interfaces operating at up to 6Gb/s enable fast and flexible system extensions, whilst the Intel Gigabit Ethernet Controller i210 ensures outstanding software compatibility. An I2C bus, an LPC bus for easy integration of legacy I/O interfaces, and Intel High Definition Audio complete the feature set.