Communications
congatec Announce COM Express Entry Modules With Intel Celeron Dual-Core Processors
congatec has announced Intel Celeron Dual-Core processors with 3rd Generation Intel Core technology for the conga-TS77 (type 6) and conga-BS77 (type 2) COM Express modules. The modules provide impressive performance and improved energy efficiency at a low price point. The modules come with the new mobile Intel HM76 Express Chipset, offers up to 16GB of dual-channel DDR3 memory (1600 MT/s) plus direct support for USB 3.0 and Intel Hyper-Threading Technology.
The The key innovations of the 3rd Generation Intel Core processors include design with 3D tri-gate transistors, 22-nanometer manufacturing and tighter integration of the Intel HD graphics core.
The COM Express modules have seven PCI Express 2.0 lanes, PCI Express Graphics 3.0 (PEG) x16 lanes for high-performance external graphics cards, four SATA ports with up to 6Gb/s, RAID support and a 1-Gbit Ethernet interface for fast and flexible system extensions. Fan control, LPC bus for easy integration of legacy I/O interfaces and Intel High Definition Audio complete the feature set.