CoM simplifies manufacture of dual interface cards

Featuring a wired card antenna, the Dual Interface CoM package technology can be fully integrated in the card material made of robust polycarbonate, which is a prerequisite for producing highly secure official documents with particularly long validity.

According IHS, between 2013 and 2019, the number of Dual Interface cards for government and healthcare will increase by 22%, greater than the 14.3% forecast for contactless cards.

To remove the process of interconnecting the chip module to the card antenna during card production, Infineon uses an RF link rather than the common mechanical-electrical connection between chip module and card antenna.

The Dual Interface CoM package technology allows dual interface cards to become more robust, as there is no connection between the chip module and the card antenna, which could be damaged through mechanical stress. The chip module is approximately one-fifth slimmer than common modules, enabling additional security features to be integrated in the card.

To produce Dual Interface cards with no further investments, card manufacturers and state printing offices can use existing production lines for contact-based chip cards. The Dual Interface CoM package technology also simplifies production processes and increases yield, decreasing manufacturing costs. According to Infineon, manufacturers can implant the chip module in the card up to five times faster than with conventional Dual Interface production methods. The technology, which is claimed to be resistant to stress for up to ten years, does not require additional tuning by the card manufacturer.

“Our CoM technology has already been well established in the payment market. We now also simplify and improve the production of long-lasting and highly secure official documents. We understand our customers’ systems and challenges and contribute to their market success with segment-specific security solutions," said Stefan Hofschen, Head of the Chip Card & Security Division, Infineon Technologies. 

Samples and starter kits of the Dual Interface CoM package technology will be available from November 2014.

Infineon will be exhibiting it's security solutions in hall 3, booth 3 E004 at Cartes Secure Connexions Event 2014, which takes place from 4th to 6th November in Paris.