Innoscience SolidGaN integrated half-bridge solution with driver

The ISG3201 is a complete half-bridge circuit that includes two 100V 3.2mΩ InnoGaN HEMTs and the required driver circuitry in an LGA package measuring just 5.0x6.5x1.1mm in size, making it both effective and compact.

Explains Yi Sun, General Manager of Innoscience America and Senior VP: “Innoscience is now offering designers a choice between the ultimate flexibility of using a discrete solution, and this new integrated approach which is very compact and simple to use and soldering and simplifying the power stage layout”.

The ISG3201 SolidGaN half-bridge comprises two 100V 3.2mΩ e-mode GaN HEMTs with driver, driving resistor, bootstrap and Vcc capacitors. It has a 34A continuous current capability, zero reverse recovery charge and ultra-low on resistance making it quite versatile. Thanks to the high level of integration, gate loop and power loop parasitics are kept below 1nH. As a result, voltage spikes on switching nodes are minimised. The Turn-On speed of the half-bridge GaN HEMTs can be adjusted using a single resistor making is customisable to specific needs.

ISG3201 is suitable for high frequency Buck converters, half-bridge or full-bridge converters, Class D audio amplifiers, LLC converters, and power modules. Overall, the integrated ISG3201 solution can save up to 20% PCB space on discrete GaN designs and 73% board space on traditional silicon implementations.

Adds Dr Pengju Kong, VP of Product Design Engineering at Innoscience: “The ISG3201 half-bridge device is the first in a whole family of SolidGaN integrated GaN-based solutions that Innoscience plans to launch this year, including further half-bridge circuits with different voltage ratings. Innoscience aims to offer engineers exactly what they want – integrated solutions or discrete devices – enabling them to achieve the best possible result for their design, minimising development time and reducing cost.”