EEA shortlist: congatec

The new Computer-on-Module conga-TC750 in the COM-Express Compact Type 6 form factor increases AI performance for demanding medical, robotics, industrial, retail and gaming applications to up to 99 TOPS. It is based on Intel Core Ultra Series 2 processors with up to 16 P and E-cores for up to 22 threads as well as integrated GPU and NPU. Especially graphics and AI intensive applications will benefit from the increased x86 and AI performance with low development effort and a short time-to-market.

The new conga-TC750 COM Express Compact modules are based on the Intel Core Ultra Series 2 processors with five-year long-term availability. This makes them ideal for all high-performance applications that require upgrades every three to five years.

In addition to the outstanding 99 TOPS, the conga-TC750 modules offer an outstanding memory capacity of up to 128 GB DDR5 memory with up to 6400 MT/s and in-band ECC. An optional NVMe x4 SSD provides up to 1 TB of non-volatile storage. To meet future connectivity requirements, the COM offers a 2.5 GbE port via Intel i226 Ethernet controller with TSN support.

Comprehensive peripheral connectivity is provided via up to 16 PCIe Gen4/5, two USB4, four USB3.2 Gen2 and eight USB2.0 ports, as well as SATA, UART, GPIOs, SPI, LPC and I2C. In terms of operating systems, congatec supports Microsoft Windows 11, Windows 10/11 IoT Enterprise, ctrlX OS, Ubuntu, Linux and Yocto. The conga-TC750 can also be used for system consolidation via the integrated hypervisor-on-module from Real-Time Systems.

Thanks to the standardised module concept for simple upgrades and high scalability, the conga-TC750 is also suitable for high-performance IPCs or thin clients, which can always be kept up to date by simply swapping modules. Furthermore, AI-supported medical imaging, test and measurement and graphics-based applications in particular benefit from the new module's performance boost.