Infineon Introduces Automotive Multicore 32-bit Microcontroller Family AURIX to Meet Safety and Powertrain Requirements of Upcoming Vehicle Generations

With its high real-time performance, embedded safety and security features the AURIX family is the ideal platform for a wide range of automotive applications such as the control of combustion engines, electrical and hybrid vehicles, transmission control units, chassis domains, braking systems, electrical power steering systems, airbags and advanced driver assistance systems. In addition, the architecture used for AURIX allows a significant reduction in workload to develop safety systems compliant with today’s highest Automotive Safety Integrity Level, the ASIL D standard. Compared to a classical Lockstep architecture safety development efforts may be reduced by 30 percent improving the time-to-market. Furthermore, up to 100 percent performance surplus allows for more functionality and sufficient resource buffer for future requirements. Additionally, to serve upcoming security requirements for better protection of automotive applications from theft, fraud and tampering, members of the AURIX family feature a built-in Hardware Security Module (HSM).

Built for Safety

The AURIX multicore architecture was developed according to an audited ISO26262 compliant process and designed to efficiently meet ASIL D on application level. The multicore architecture uses up to two TriCore CPUs in diverse lockstep architecture combined with cutting edge safety technology such as safe internal communication buses and a distributed memory protection system. Innovative encapsulation techniques allow integration of software with mixed-criticality levels (up to ASIL D) from different sources, enabling multiple applications and operating systems to be seamlessly hosted on a unified AURIX platform.

Built for Performance

The AURIX multicore architecture offers best in-class real-time performance at a low power consumption using three parallel TriCore CPUs running at up to 300MHz combined with a powerful Generic Timer Module (GTM). AURIX microcontrollers provide up to 100 percent additional performance compared to the TC1798 manufactured in 90nm technology, which is currently the highest performing automotive microcontroller in the market. This improved performance is achieved with power consumption equivalent to Infineon’s current AUDO MAX microcontroller family.

”The AURIX microcontroller family with its best-in-class real-time performance and high processing power enables to meet the increasing requirements of our next generation engine platforms: lower CO2 emissions at increased engine performance,” said Josef Bast, head of powertrain electronics development at the Audi AG in Ingolstadt, Germany.

Built for Security

Anticipating upcoming security and protection requirements Infineon has integrated a programmable hardware security module (HSM) into the AURIX family. The HSM uses leading edge hardware-based encryption technology developed by Infineon, the world’s technology leader in hardware-based security technology. This HSM as “embedded chip card” enhances protection against attacks of IP infringement, fraud and software hijacking.

Highly Scalable

The AURIX family comes with a comprehensive range of fully modular components from the ultra high end to the low end ensuring long-term design flexibility. The portfolio comprises 300MHz triple core devices with 8MByte (MB) of embedded Flash (eFlash), 200MHz triple core devices with 4MB eFlash, 200MHz dual core devices with 2.5MB eFlash, as well as 130MHz and 80MHz single core and single core lockstep devices with 1.5MB, 1MB and 0.5MB of eFlash. The package options include BGA-516 package with a ball-compatible BGA-292 package (I/O subset), and compatible LQFP-176, LQFP-144, LQFP-100 and LQFP-64 packages.

All AURIX family members are manufactured in a 65nm embedded Flash technology designed for highest reliability in the harsh automotive environment. To ensure a continuous supply with premium quality Infineon has set-up a dual frontend supply concept with two locally separated production sites using identical certified processes and tooling.

Tools and Support

Infineon's tool partners offer a wide range of tools specifically adapted to AURIX to assure optimal design flow and to control the effort and cost of multicore software development.

The powerful tool chain includes highly optimizing C/C++ cross compilers, debuggers with rich functionality for efficient debugging and tracing. In addition, dedicated measurement, calibration and diagnostics tools provide the functionality needed for the development of powertrain ECUs.

All typical issues of multicore software development such as correctness, performance and scalability are addressed, e. g. with enriched Compiler versions and well established timing and scheduling analysis tools. Several feature-rich simulation packages facilitate model based development of customer circuitry around AURIX devices and can easily be connected to modeling environments such as Matlab Simulink.

A free-of-charge TriCore Entry Tool Chain comprising a fully functional GNU C Compiler including Debugger and an Eclipse based development environment can be downloaded from the Infineon TriCore product web site.

Infineon provides MC-ISAR low-level drivers based on the AUTOSARv4 MCAL and support for the upcoming v3.2. This allows designs to take full advantage of an AUTOSAR-based development process at the control unit level. The AUTOSAR drivers are based on a technology developed by Infineon since 2005. Infineon’s in-house software development is certified according the CMM level 3 standard to ensure optimized and qualified software releases. Currently the implementation of an ASPICE certification is ongoing.

Availability

Early engineering samples of the 200MHz triple core lead device with 4MB eFlash of the AURIX family in a LQFP-176 package (TC275T) and in a BGA-292 package (TC277T) have already been released to key customers. General sampling is scheduled to start in the first half of 2013. Qualification of the first product is planned in the second half of 2013.