Analysis

Tensilica and mimoOn Partner for LTE Baseband Handset Solutions

10th February 2010
ES Admin
0
mimoOn, a pioneer in LTE software implementations for programmable radio platforms, and Tensilica® Inc., a leader in programmable and efficient IP cores for advanced mobile wireless SOCs (system-on-chips), today announced a partnership to offer best-in-class LTE solutions for mobile wireless radios based on mimoOn's mi!MobilePHY software and Tensilica's newly announced ConnX Baseband Engine (BBE16) and ConnX Atlas LTE Reference Design.
/> mi!MobilePHY is a full-featured and certified LTE software solution for user equipment (handsets) that supports mandatory and optional features in the 3GPP Release 8 standard. mimoOn's software is modular and written in ANSI-C language, which allows flexibility and scalability, with innovative algorithms such as advanced MIMO detectors. miMobilePHY(TM) is written for low memory and low power consumption.

Tensilica's ConnX BBE based wireless radio platform enables efficient baseband processing for 3G, LTE and 4G wireless equipment. The combination of Tensilica's optimized high-performance DSPs (digital signal processors) and controllers integrated in a single dataplane processor (DPU) platform provides designers with the ability to make the right tradeoffs between size, power and programmability to meet the challenging needs of the next generation radios.

Tensilica offers a high performance, yet low power, programmable hardware platform for LTE and 4G designs, stated Thomas Kaiser, CEO of mimoOn. Our collaboration with Tensilica will enable customers to build high quality solutions for the LTE release 8 standard, with a clear upgrade path for release 9 and 10, as well as backwards compatibility with some of the legacy standards.

mimoOn offers a high-quality algorithm and proven implementation for LTE software, stated Jack Guedj, Tensilica's President and CEO. With this partnership, we can provide our customers an efficient programmable mobile wireless radio reference platform to accelerate their time to market.

Featured products

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier