At SPIE Photonics West 2012, imec presents its R&D into next generation vision systems, high-end CMOS imagers and silicon photonics

Imec’s silicon photonics platform allows miniaturization of complex photonic functions on a single chip and a dense integration of photonics and electronics, well-suited for the development of photonic components with nanometer-scale accuracy over large writing fields, enabling true large-scale photonic integrated circuits. Recently, a new EU FP7 project, ESSenTIAL, was launched with the goal to allow a better industrial access to silicon photonics technology. This will be realized by expanding the services of the ePIXfab-service, taking care to build a more complete technology chain from idea to product.



Imec’s high-end image sensor manufacturing platform offers development and low-volume production of customer specific specialty imagers. The base line technology is a 0.13 µm CMOS platform including a pinned photodiode module processed on 200 mm silicon wafers. We offer large flexibility in terms of processes deviating from standard CMOS such as special (epi) substrates, pixel trench isolation, stitching, backside illumination and others.



New releases at SPIE photonics West 2012

>A compact, low-cost and fast hyperspectal imaging solution

At SPIE Photonics West 2012, imec demonstrates a hyperspectral camera solution based on a system-on-chip image sensor with an integrated hyperspectral sensor. Imec’s prototype hyperspectral camera automatically classifies different objects using state-of-the-art image processing methods. Classification results of imec’s solution are equivalent to state-of-the-art hyperspectral references and recorded spectra of e.g. plant material. Imec’s solution is small, cost-efficient and fast. It targets multiple industrial vision applications.

>Disposable silicon photonics biosensor chips

Imec, together with a medical diagnostics equipment supplier, have developed and produced a set of disposable silicon photonics biosensor chips combining imec’s standard silicon photonic waveguide devices with a unique bio-compatible passivation technology. The chips allow for multiplexed biosensing. After optimization of the proof-of-concept chips that were produced through the ePIXfab multi-project wafer service, the chips were prototyped as part of imec’s CMORE service. A bio-compatible passivation technology was developed on 200mm wafer scale, the chips were tested in the field, and proven to meet the customers functional requirements with high yields.



Spokespeople at SPIE Photonics West

>Andy Lambrechts, Team leader NVISION at imec

>Danaë Delbeke, Photonics Technology Developer at INTEC, imec’s associated lab at Ghent University

>Ann Verbeeck, Senior Business Development Manager NVISION and Si Photonics at imec



Imec presentations at the SPIE Photonics West conference

>Masschelein, B. (imec) et al. - Advanced Quantitation in Cells (Cytomics) and Tissues (Histomics)-Part 2: Toward a colony counting system using hyperspectral imaging

> Vercruysse, D. (imec) et al. - Subradiant plasmon resonances for spacing,

> Tack, N. (imec) et al. - A compact high-speed and low-cost hyperspectral imager

>Wang, L. (INTEC) Grating couplers in polymer with a thin Si3N4 layer embedded

>Yebo, N. (INTEC) On-chip interrogation of a silicon-on-insulator microring resonator based ethanol vapor sensor with an arrayed waveguide grating (AWG) spectrometer