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IMEC Articles
Automotive industry comes together to discuss chiplets
At an exclusive event in Ann Arbor, Michigan, the Automotive Chiplet Forum 2024 brought together key players in the global automotive ecosystem to discuss the shift towards chiplets in vehicles.
imec announce lithium-metal solid-state battery
imec, together with 13 European partners, announces the development of a high-performance lithium-metal solid-state battery.
Imec achieves record-low charge noise for Si MOS quantum dots
Imec, a global research and innovation hub in nanoelectronics and digital technologies, has announced the demonstration of high quality 300mm-Si-based quantum dot spin qubit processing with devices resulting in a statistically relevant, average charge noise of 0.6µeV/ÖHz at 1Hz.
Best-in-class ADCs for base stations and smartphones
At this week's IEEE Symposium on VLSI Technology & Circuits, imec introduced two advanced ADCs for base stations and handsets.
Imec demonstrates functional monolithic CFET devices
This week, at the 2024 IEEE Symposium on VLSI Technology & Circuits (2024 VLSI), imec presents for the first time electrically functional CMOS CFET devices with stacked bottom and top source/drain contacts.
Imec unveils CMOS-based beamforming transmitter
At this week’s IEEE RFIC Symposium, imec, a global pioneering research and innovation hub in nanoelectronics and digital technologies, presents a state-of-the-art CMOS-based beamforming transmitter for D-band wireless applications.
ASML and imec open joint High NA EUV Lithography Lab
Imec, a global research and innovation hub in nanoelectronics and digital technologies, and ASML, a pioneering lithography supplier to the semiconductor industry, have announced the opening of the High NA EUV Lithography Lab in Veldhoven, the Netherlands, a lab jointly run by ASML and imec.
Imec demonstrates new die-to-wafer hybrid bonding
At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...
Imec demos 32-channel silicon-based wavelength filter
Imec showcased a significant breakthrough in the field of silicon-based wavelength-division multiplexing (WDM) at the OFC Conference in San Diego.
Spain, Andalusia, and imec to set up 300mm chip R&D line
The Spanish government, together with the regional government of Andalusia and imec, a global research and innovation hub in nanoelectronics and digital technology, announced that they have signed a Memorandum of Understanding (MoU) outlining their intent to establish a specialised chip technology pilot line in Malaga (Andalusia).
AMD’s Lisa Su honoured with the 2024 imec Innovation Award
Imec is delighted to announce Lisa Su, Chair and CEO of AMD, as the recipient of the 2024 imec Innovation Award.
Imec debuts high-speed ADC, leads in efficiency
At this week’s IEEE International Solid-State Circuits Conference (IEEE ISSCC2024), imec, a global research and innovation hub in nanoelectronics and digital technologies, introduces a breakthrough architecture that lays the foundation for a whole new generation of analog-to-digital converters (ADCs)
Ime’s resilient, low-power UWB receiver chip
At this week’s IEEE International Solid-State Circuits Conference (IEEE ISSCC2024), imec, a global research and innovation hub in nanoelectronics and digital technologies, presents a low-power ultra-wideband (UWB) receiver chip that is ten times more resilient against interference from Wi-Fi and (beyond) 5G signals than existing, state-of-the-art UWB devices.
Imec introduces compact wireless powering technology
Imec has introduced an ultrasound-based proof-of-concept for wireless powering of implantable devices, at this week’s International Solid-State Circuits Conference (IEEE ISSCC 2024).
imec achieves breakthrough in SOT-MRAM technology
This week, at the 2023 International Electron Devices Meeting (IEEE IEDM 2023), imec, a globally pioneering research and innovation hub in nanoelectronics and digital technologies, presents extremely scaled spin-orbit transfer magnetic random-access memory (SOT-MRAM) devices showing the best published performance ever.
Imec presents a new way to render colours with sub-micron pixel sizes
This week at the 2023 International Electron Devices Meeting (IEEE IEDM 2023), imec, a global research and innovation hub in nanoelectronics and digital technologies, demonstrates a new method for faithfully splitting colours with sub-micron resolution using standard back-end-of-line processing on 300mm wafers.
Newly founded chip manufacturer joins imec’s Core Partner Programme
Imec, a global research and innovation hub in nanoelectronics and digital technologies, and Rapidus, Japan’s newly founded chip manufacturer, have announced that they have taken an important next step in setting up a long-term and sustainable collaboration in the domain of advanced semiconductor research, with Rapidus joining imec’s Core Partner Programme.
Imec’s virtual fab underpins strategies to reduce carbon footprint
At the 2023 Advanced Lithography + Patterning Conference, imec presents a quantitative assessment of the environmental impact of patterning in advanced IC manufacturing.
Imec's co-integration of its SiN waveguide technology with its active silicon photonics platform
At an invited talk at SPIE Photonics West, San Francisco, imec announced that it demonstrated co-integration of its silicon nitride waveguide technology with its silicon photonics platform—without performance degradation of the high-bandwidth active devices. An important upgrade for their silicon photonics platform, the result enables the synthesis of high-quality wavelength-selective devices and other optical passive functions that benefit...
Imec hyperspectral camera pave way for in-vivo detection of low-grade gliomas
At this week’s BiOS, the biomedical optics and biophotonics exhibition at SPIE Photonics West, imec – a global research and innovation hub in nanoelectronics and digital technologies – presents a promising path to the in-vivo detection of low-grade gliomas (a group of slow-growing brain tumours).