At the 2024 IEEE International Electron Devices Meeting (IEDM), imec, a global research and innovation hub in nanoelectronics and digital technologies, and its partners in the Belgian project Q-COMIRSE, present a first of its kind prototype shortwave infrared image sensor with indium arsenide quantum dot photodiodes.

This week, at the 2024 IEEE International Electron Devices Meeting (IEDM), imec demonstrates the three critical building blocks of a superconducting digital circuit: NbTiN-based interconnects; Josephson junctions; and MIM capacitors.

At the 2024 IEEE International Electron Devices Meeting (IEDM), imec, a leading research and innovation hub in nanoelectronics and digital technologies, presents a new CFET-based standard cell architecture containing two rows of CFETs with a shared signal routing wall in between.

At an exclusive event in Ann Arbor, Michigan, the Automotive Chiplet Forum 2024 brought together key players in the global automotive ecosystem to discuss the shift towards chiplets in vehicles. 

imec, together with 13 European partners, announces the development of a high-performance lithium-metal solid-state battery.

Imec, a global research and innovation hub in nanoelectronics and digital technologies, has announced the demonstration of high quality 300mm-Si-based quantum dot spin qubit processing with devices resulting in a statistically relevant, average charge noise of 0.6µeV/ÖHz at 1Hz.

At this week's IEEE Symposium on VLSI Technology & Circuits, imec introduced two advanced ADCs for base stations and handsets.

This week, at the 2024 IEEE Symposium on VLSI Technology & Circuits (2024 VLSI), imec presents for the first time electrically functional CMOS CFET devices with stacked bottom and top source/drain contacts.

At this week’s IEEE RFIC Symposium, imec, a global pioneering research and innovation hub in nanoelectronics and digital technologies, presents a state-of-the-art CMOS-based beamforming transmitter for D-band wireless applications.

Imec, a global research and innovation hub in nanoelectronics and digital technologies, and ASML, a pioneering lithography supplier to the semiconductor industry, have announced the opening of the High NA EUV Lithography Lab in Veldhoven, the Netherlands, a lab jointly run by ASML and imec.

At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...

Imec showcased a significant breakthrough in the field of silicon-based wavelength-division multiplexing (WDM) at the OFC Conference in San Diego. 

The Spanish government, together with the regional government of Andalusia and imec, a global research and innovation hub in nanoelectronics and digital technology, announced that they have signed a Memorandum of Understanding (MoU) outlining their intent to establish a specialised chip technology pilot line in Malaga (Andalusia).

Imec is delighted to announce Lisa Su, Chair and CEO of AMD, as the recipient of the 2024 imec Innovation Award.

At this week’s IEEE International Solid-State Circuits Conference (IEEE ISSCC2024), imec, a global research and innovation hub in nanoelectronics and digital technologies, introduces a breakthrough architecture that lays the foundation for a whole new generation of analog-to-digital converters (ADCs)

At this week’s IEEE International Solid-State Circuits Conference (IEEE ISSCC2024), imec, a global research and innovation hub in nanoelectronics and digital technologies, presents a low-power ultra-wideband (UWB) receiver chip that is ten times more resilient against interference from Wi-Fi and (beyond) 5G signals than existing, state-of-the-art UWB devices.

Imec has introduced an ultrasound-based proof-of-concept for wireless powering of implantable devices, at this week’s International Solid-State Circuits Conference (IEEE ISSCC 2024). 

This week, at the 2023 International Electron Devices Meeting (IEEE IEDM 2023), imec, a globally pioneering research and innovation hub in nanoelectronics and digital technologies, presents extremely scaled spin-orbit transfer magnetic random-access memory (SOT-MRAM) devices showing the best published performance ever.

This week at the 2023 International Electron Devices Meeting (IEEE IEDM 2023), imec, a global research and innovation hub in nanoelectronics and digital technologies, demonstrates a new method for faithfully splitting colours with sub-micron resolution using standard back-end-of-line processing on 300mm wafers.

Imec, a global research and innovation hub in nanoelectronics and digital technologies, and Rapidus, Japan’s newly founded chip manufacturer, have announced that they have taken an important next step in setting up a long-term and sustainable collaboration in the domain of advanced semiconductor research, with Rapidus joining imec’s Core Partner Programme.