Analysis
Densitron to Reveal New Bonding Facility and TFT & E-paper Design Solutions at Electronica 2012
In the upcoming Electronica Exhibition, Densitron’s proprietary E-paper Evaluation Kit and RipDraw Display and Design Solution will be unveiled. These new offerings promise to significantly reduce product development time and cost. Densitron will also introduce its new optical bonding facility and capability to add cover lenses or PCTs to any display using a reworkable process
The New E-paper Evaluation Kits will be launched for screen sizes of 1.44”, 2.0” and 2.7”. Each kit comes with a controller board and a data and power board. The latter board receives data and power from PC USB interface and supplies data and power to the controller board via a UART or SPI interface.
The Densitron Bonding facility is located in Taiwan and uses state of the art Japanese Bonding technology to provide quality and cost-effective bonding solutions.
In addition to new product introduction, Densitron will demonstrate its extensive technical expertise on OLEDs, covering Monochrome, Full Colour and Alphanumeric modules with various interface options and development kits. Industrial grade cost-effective LCD modules and TFT displays with impressive optical parameters will also be showcased.
For applications that require enhanced displays, Densitron offers Engineering Design Service which offers options on integrating standard or custom display modules with PCB, Plastics, Keypads and/or Touch Overlays.
Visitors to Densitron’s Booth A3.251 will be able to sample the latest display technologies and design solutions available today and to see product examples from Densitron’s bonding service and Engineering Design projects.
Dedicated representatives from Densitron's technical support team will be present to provide assistance with choosing the right display and to offer advice on display integration.