Printed electronics thought leaders at innoLAE Industry Day 2020

Printed electronics enables the mass production of extremely thin, cost-effective and flexible electronic circuits. The technology can deliver electronic functionality to a far wider range of surfaces than conventional rigid circuits. As such, it has broad applications ranging from authentication labels for the food and beverage industry to medtech wearables and the Internet of Things. The market has expanded rapidly over the last decade, growing to one worth over £20 billion. CPI has gained extensive experience in this burgeoning sector, and has established a large industry network through work at its National Printed Electronics Centre.

The free one-day event will draw around 100 delegates to the prestigious Wellcome Genome Campus, Hinxton, UK, and will set the scene for the innoLAE 2020 conference that starts the following day. The event begins with a keynote address from Raghu Das, CEO at IDTechEx, a leading printed and organic electronics consultancy company. Other confirmed speakers showcase the wide applications of the technology and include Sven Strassburg, Watson Internet of Things Lead Architect at IBM; Andy Smith, Technical Packaging Director at GSK; Jonas Vandecruys, Global Packaging Development Engineer at AB InBev; and Neil Chilton, co-founder of Printed Electronics Limited.

The industry experts will discuss market drivers and explain how printed and flexible electronics can be implemented across different industries to access significant benefits. As part of the event, SMEs will also have the invaluable opportunity to take part in quick-fire pitches to these active industry experts. The day will close with networking drinks and canapes. The full agenda and registration information can be found here.

John Cocker, Director of Printable Electronics at CPI said: “We are delighted to welcome the printed electronics industry to the innoLAE Industry Day 2020. Building on last year’s hugely successful meeting, we hope to foster discussion that accelerates industrialisation of flexible and hybrid electronics. This advanced technology has huge potential and the event is an important catalyst to enable the collaborations and knowledge-sharing that lead to innovation.”