Analysis
Nordson DAGE to Exhibit at NEW South Africa 2012
Nordson DAGE announces that it will highlight its new X-Plane technology in Stand C7 at the upcoming National Electronics Week (NEW) South Africa, scheduled to take place March 13-14, 2012 at the Sandton Convention Center in Johannesburg.
“NX-Plane™ is a revolutionary option for its range of industry-leading X-ray inspection systems that uses a proprietary, patent applied for tomosynthesis, or CT technique, to create 2-D X-ray slices in any plane of a printed circuit board assembly, without the need to cut or destroy the board. In this way, the superior image quality that Nordson DAGE X-ray systems always provide can now be extended into separating individual layers at a level of excellence that the traditional laminography technique cannot achieve. X-Plane™ technology is quick, simple and easy-to-use. The board is placed in the Nordson DAGE X-ray inspection system and oblique-angled X-ray images are taken 360° around the region of interest. X-Plane™ shows the position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc. Additionally, the technology can identify Head-on-Pillow (HoP) and open joints.