Analysis

Nordson DAGE to Exhibit at NEW South Africa 2012

9th March 2012
ES Admin
0
Nordson DAGE announces that it will highlight its new X-Plane technology in Stand C7 at the upcoming National Electronics Week (NEW) South Africa, scheduled to take place March 13-14, 2012 at the Sandton Convention Center in Johannesburg.
“Nordson DAGE continues to view South Africa as a strategic region for the future and has a good number of systems installed that are providing a high level of customer satisfaction in the area. We have been very active in this market for six years and will continue to bring our unique technology driven market leading systems, together with unrivalled service and support to South Africa,” Keith Bryant, Nordson DAGE’s Global X-ray Sales Director. “Please visit our stand for more information and to find out about X-Plane a recently released option which is creating a huge buzz within the PCBA industry, with its unique advantages.”

X-Plane™ is a revolutionary option for its range of industry-leading X-ray inspection systems that uses a proprietary, patent applied for tomosynthesis, or CT technique, to create 2-D X-ray slices in any plane of a printed circuit board assembly, without the need to cut or destroy the board. In this way, the superior image quality that Nordson DAGE X-ray systems always provide can now be extended into separating individual layers at a level of excellence that the traditional laminography technique cannot achieve. X-Plane™ technology is quick, simple and easy-to-use. The board is placed in the Nordson DAGE X-ray inspection system and oblique-angled X-ray images are taken 360° around the region of interest. X-Plane™ shows the position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc. Additionally, the technology can identify Head-on-Pillow (HoP) and open joints.

Featured products

Upcoming Events

No events found.
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier