Launch of Research Project on Maximum Integration and Miniaturization of Microelectronic Systems for Automotive, Industrial and Communication Electronics

The results of the ESiP project should help put Europe in a leading position in the development and manufacture of miniaturized microelectronics systems. In the future, several chips with different production techniques and structure widths will be integrated in a standard chip package for more and more applications. These might be, for example, a special 45-nm processor, a high-frequency 90-nm transmit/receive chip, sensors and passive components such as miniaturized capacitors or special filters. The aim of ESiP is to investigate the reliability of new production processes and materials required to build a System in Package (SiP). The project will also involve developing new methods for error analysis and testing. The results of the ESiP project will in future be used, for example, in electric vehicles, medical equipment and communication technology devices.

SiP technologies are understood to be base technologies for future microelectronics systems which make complete technical solutions possible such as microcameras in the smallest of spaces in one SiP package. This entails, for example, stacking different types of chips (3D integration), combining them intelligently and integrating them in a functional chip package. Infineon's contribution to the ESiP project is to further develop system integration solutions comprising several microchips and improve them in terms of failure analysis, reliability and testability.