Analysis
Infineon Technologies and Mitsubishi Electric Team Up to Serve the Global Power Electronics Industry
Infineon Technologies and Mitsubishi Electric Corporation agreed to establish a service agreement by which they will both serve the industrial motion controls and drives market worldwide as sources for the advanced IGBT module packages SmartPACKs and SmartPIMs. This revolutionary package concept, recently developed by Infineon Technologies, will be available with the latest generation of power chip technologies from the two leaders.
UndeUsers of SmartPACK/-PIM will now benefit from the new cooperation of two worldwide leading IGBT module manufactures.