Analysis
Infineon Technologies and Fairchild Semiconductor Enter Into Compatibility Agreement for Power MOSFETs
Infineon Technologies and Fairchild Semiconductor today announced a packaging partnership for their power MOSFETs in the Infineon PowerStage 3x3 or Fairchild MLP 3x3 (Power33™) packages.
The Standardizing power packages benefits our customers as we minimize the amount of ‘unique’ packages available in the market place, while offering solutions that enhance performance levels in smaller form factors than the previous generations, said Richard Kuncic, director and product line manager Low Voltage MOSFETs at Infineon Technologies.
“Fairchild and Infineon have standardized the pin-out and have complementing performance levels, offering customers two sources for their high efficiency design needs in the computing, telecom and server markets, said John Bendel, Fairchild’s senior vice president of Low Voltage Products. “This package alignment is staged to deliver performance leading products in a multi-source, industry standard package.”