imec, Toshiba & SanDisk expand partnership
Today at the Imec Technology Forum, imec announces that Toshiba and SanDisk have joined the research centre's industrial affiliation programme on advanced patterning. The programme tackles the critical challenges that remain in bringing EUVL to high volume manufacturing and also develops other technologies for extending 193nm immersion lithography.
Toshiba and SanDisk have been core partners in imec’s industrial affiliation programme in Advanced Memory since 2011 and have now expanded their strategic partnership.
“This expanded agreement with Toshiba and SanDisk represents the next step in our long-term strategic and fruitful partnership. We are proud to join forces and strengthen our collective research competence in advanced patterning,” said Luc Van den hove, President and CEO, imec. “The agreement is a testament of the industrial value and impact our R&D programmes have on advanced semiconductor scaling. To date, this program, supported by our world-class infrastructure, represents the largest investment in advanced lithography equipment in the world.”
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