EnSilica partners with Cross Border Technologies to accelerate sales growth in key European and Asian markets

The move is intended to build on the initial design win successes that EnSilica has recently achieved in these markets, particularly for mixed signal applications.



Headquartered in Germany (Munich area) with subsidiary offices in (Tokyo) Japan and Korea (Seoul), Cross Border Technologies specialises in the provision of business development and representative sales services for technology companies wanting to penetrate these geographic markets quickly and efficiently. The company’s personnel deliver decades of sales and business development expertise derived from their experience working in similar roles and markets for Germany’s leading semiconductor company.



“We have extended our international footprint considerably over the past few years,” said Ian Lankshear, CEO of EnSilica. “Our partnership with Cross Border Technologies will enable us to actively develop new business opportunities in key European and Asian markets, in parallel with our ongoing expansion efforts in the USA and our core home market.”



The appointment of Cross Border Technologies complements EnSilica’s existing international focus on the USA. EnSilica has made significant in-roads in the USA and Canada with sales of its eSi-RISC family of highly configurable, embedded processor cores that are particularly suited to low power needs. It has also recently established a subsidiary company in Sunnyvale, California. The appointment further complements the opening of EnSilica’s design and verification centre in India last year.



“EnSilica is an ambitious company and we are extremely pleased they have chosen to partner with us to create a stronger presence in Germany, France, Japan and Korea,” said Dr Andreas vom Felde, Managing Director of Cross Border Technologies. “We have a proven track record in these markets, so we are extremely confident that we shall generate quality, revenue-creating opportunities for EnSilica’s IC design services and system IP solutions. From board level executives through middle management to engineers, we make our extensive connections work effectively for our clients.”



EnSilica’s IC design services provide a scalable resource for projects requiring larger teams to accelerate timescales or deal with complex tasks such as turnkey ASIC designs or UVM based functional verification. Cross Border Technologies will represent EnSilica’s full range of turnkey ASIC and FPGA design capabilities, from system level design, RTL coding and advanced verification using a range of methodologies including UVM through to analog/mixed-signal modelling, physical implementation and embedded software services. Additionally, Cross Border Technologies will represent EnSilica’s successful portfolio of IP including its eSi-RISC highly configurable 16/32 bit embedded processors, eSi-Comms range of communications IP, eSi-Connect range of processor peripherals and eSi-Crypto encryption IP.