SIAE MICROELETTRONICA, a provider of microwave radio and wireless network solutions, has selected EnSilica, a turnkey supplier of mixed signal ASICs and SoCs, to assist the design of Application-Specific Integrated Circuits (ASICs) for its next-generation telecommunication infrastructure products.

Omni Design Technologies and EnSilica have announced an extended partnership for the Swift Data Converter IP portfolio.

EnSilica has announced that it has joined the Design Center Alliance (DCA) of TSMC Open Innovation Platform (OIP).

EnSilica has added a range of Post-Quantum Cryptography (PQC) accelerators to its eSi-Crypto range of hardware accelerator IP.

Ensilica has revealed its collaboration with VITES to provide a beamformer chip tailored for satellite user terminals. Central to VITES's new ViSAT-Ka-band terminal, this chip will facilitate the design.

Ensilica has announced the development of a custom chassis-control ASIC, which has entered mass production, and will appear in vehicles later this year.

Ensilica has created a customisable single-chip medical sensor ASIC platform to speed the development of wearable medical / fitness vital-sign monitoring products.

EnSilica has announced it is developing a single-chip Ka band satellite transceiver IC for the European Space Agency. The mmWave IC will form a key component of next-generation, low-cost hybrid automotive communication terminals – enabling vehicles to always be connected.

Alternative SME credit specialist Caple has supported d EnSilica, a leading bespoke chip design and supply firm, with a £3.7m fully unsecured loan.  This will enable EnSilica to continue its expansion into high-growth sectors including automotive, space and the Internet of Things (IoT). EnSilica funds the design and supply of silicon chips for customers and then takes a share of the revenues once the chip design is proven.  G...

EnSilica has won the Queen's Award for International Trade. This latest and most prestigious award for EnSilica reflects the dynamic growth that the company has achieved over the last three years. Ian Lankshear, Managing Director and co-founder commented, "We are honoured to receive this recognition for everyone's hard work in turning EnSilica into major force in the British electronics Industry."  

  EnSilica has announced that it has become an Arm Approved Design Partner. The company is experienced in developing digital and mixed signal SoCs and has been integrating third party IP into designs since EnSilica was founded in 2001.

  EnSilica has announced that it is extending its full service of chip design through to volume supply to meet the increasing requirements from the automotive market. To support this, the company has signed a Representative Agreement with Lojixx Technologies, who have many years of experience in the automotive market with market knowledge.

A key innovation that will help the rapid development of autonomous cars has been announced by EnSilica. Its eSi-ADAS RADAR Imaging Co-processor will accelerate the commercialisation of autonomous vehicles by solving the current problem of RADAR data overload and resolution by handling this in a dedicated co-processor to enable tracking of potentially hundreds of objects to be made in real time.

  Provider of semiconductor solutions and IP, EnSilica and Solomon Systech, a provider of touch and display ICs and system solutions, have entered into a multi-year licensing agreement for EnSilica’s range of highly configurable, high performance, and low power eSi-RISC processor IP.

EnSilica and sureCore have announced that EnSilica has developed sureCore’s new, ultra-low power IoT reference platform targeted principally at the development of the next generation of wearable consumer and medical applications. With proven expertise in low power SoC design for battery powered applications, EnSilica’s experienced silicon team is able to deliver a complete, turn-key service covering complex digital and analog/RF ...

Independent provider of semiconductor solutions and IP, EnSilica has further expanded its network of specialist design centres with the establishment of a facility near Oxford (UK) focusing on RF and low power sensing applications. The RF and low power sensing design centre will be headed up by Alan Wong, formerly the IC Design Director at Frontier Microsystems.

EnSilica has teamed with BaySand, to provide customers of BaySand’s newly launched ASIC UltraShuttle-65 Multi-Project Wafer (MPW) with a range of IP solutions that can be configured to their specific application requirements. The IPs will comprise EnSilica’s eSi-RISC processor cores, eSi-Connect processor peripherals, eSi-Crypto encryption and eSi-Comms communications IP solutions as well hardware accelerators.

EnSilica have partnered to successfully port Micrium’s µC/OS-III RTOS to EnSilica’s family of eSi-RISC processor cores. Micrium’s µC/OS-III is available on eSi-RISC with immediate effect. In addition, Micrium’s range of communication software, including its USB host/USB device and TCP/IP networking protocol stack, has been ported to EnSilica’s eSi-RISC.

EnSilica has launched the eSi-ECDSA cryptographic IP designed to help meet the high security communication and latency requirements of automotive Car2Car and Car2Infrastructure (Car2x) applications that form part of today’s emerging Intelligent Transport Systems.

EnSilica has launched a Kalman Filter acceleration IP core for use in situational awareness radar sensors for ADAS, such as electronic stability control systems, pre-crash impact mitigation, blind spot detection, lane departure detection and self-parking.