Analysis

BTU’s Fred Dimock to Participate in Reflow Optimization Discussion during NEPCON Shanghai

30th March 2012
ES Admin
0
BTU International, Inc announces that Fred Dimock will present at the upcoming Optimizing Reflow of Lead-Free Boards and BGAs round table discussion hosted by EMSNow on Thursday, April 26 at 3:30 p.m. The discussion will take place during the NEPCON Shanghai exhibition at the Shanghai World Expo Exhibition & Convention Center.
The round table discussion will address best practices in lead-free solder electronics assembly. Methods of optimizing reflow oven profiling for consumer, commercial, and high-reliability aerospace and defense applications will be discussed. Additionally, critical issues concerning lead-free electronics such as tin whiskers and solder joint reliability will be considered.

Dimock is the manager of Process Technology at BTU International. His extensive experience in thermal processing includes positions at Corning, General Electric, and Sylvania. Additionally, he has authored numerous articles on lead-free processing and process control.

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