Analysis

Avago Technologies Extends Alliance with TSMC to include the next two generations of its enhanced-performance image sensor products

20th July 2006
ES Admin
0
Avago Technologies today (July 20) announced that it has extended its agreement with TSMC to include the next two generations of its enhanced-performance image sensor products. Avago's 1.3-megapixel and newly introduced 2-megapixel sensors are already manufactured by TSMC and exhibit superior image quality and excellent uniformity. Avago Technologies will continue to work with TSMC to produce industry-leading multi-megapixel imaging products for the camera phone, computing, industrial and security market.
Avago's TSMC-built image sensors feature the company's superior EP pixel architecture, which allows mobile phones and computing devices to take sharper, truer color photos in all lighting conditions. Avago's EP-based image sensors achieve an unprecedented 10X reduction in noise, eliminating the CMOS-CCD image-quality gap. TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven library, IP, design tools and reference flows.

"With increased competition and fast changing customer demands within the camera phone market, close relationships between sensor module designers and their fabricators are key," said Chris Crotty, analyst at iSuppli. "This deepened alliance between Avago and TSMC allows each party to focus on their respective core competencies, resulting in delivery of higher quality sensors in a shorter time frame."

"This agreement with TSMC extends both companies' commitment to the CMOS image sensor market," said Todd Metcalf, vice president of Avago's Mobile Imaging Business. "Combining our innovative EP and image pipe intellectual property with TSMC's process will enable us to continue delivering leading edge products and faster time-to-market advantages to our customers."

Featured products

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier