Analysis

A New Low-Cost Conductive LED Die Attach Adhesive Is Now Available for Small Die and LEDs

30th April 2013
ES Admin
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Engineered Material Systems debuts its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.
EMS CA-105 is approximately half the cost of a pure silver filled die attach adhesive, has a high glass transition temperature (Tg) to facilitate wire bonding small die, has low extractable ionics and high adhesion to silver and copper lead frames. CA-105 has a dispensing open time (pin transfer) greater than 24 hours (measured as a 25 percent increase in viscosity), while maintaining optimized rheology for pin transfer or needle dispensing.

CA-105 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

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