SH-Mobile Application Processors for Digital TV capable mobile phones

The new ICs incorporate the high-performance SH4AL-DSP CPU core, achieving high processing performance of 478 MIPS (million instructions per second) at a maximum operating frequency of 266 MHz. Thus, offering ample performance to support various digital TB mobile phone solutions such as ISDB-T in Japan, DVB-H in Europe and DMB in South Korea.

The SH-MobileL3V2 features on-chip image quality improvement functions such as gamma correction and enlargement edge enhancement function. The gamma correction functions available are histogram extension, screen brightness correspondence and adaptive type chroma. This allows adjustment of image quality for individual TV scenes, enabling clear, high-quality video display to be achieved. The enlargement edge enhancement function prevents fuzziness when a QVGA-size image is enlarged to VGA or WVGA size. Such picture quality improvement is achieved by performing enhancement and inter-dot compensation in edge areas, and noise elimination by means of a filter.
Further features are a dedicated on-chip 24-bit audio DSP for low-power audio processing and a 5Mpix capable camera interface. Additional on-chip peripheral functions suited to mobile phone systems include an LCD controller supporting 24-bit TFT colour liquid crystal panels, an SD memory card interface, a SIM card interface, and a sound interface.

The SH-MobileUL features an optimized set of peripheral functions specialized for terrestrial digital broadcast applications. While incorporating the same moving image engine and high-performance CPU core as the SH-MobileL3V2, the SH-MobileUL is a cost-performance oriented product. It has more compact dimensions due to a smaller pin count and the use of a small 8 mm × 8 mm package. This enables the mounting area to be reduced by approximately 30% compared with the previous SH-Mobile products.

The SH-MobileL3V2 uses a 281-pin BGA package (9 mm × 11 mm, 0.5 mm pin pitch), and the SH-MobileUL a small 224-pin BGA package (8 mm × 8 mm, 0.5 mm pin pitch). The SH-MobileL3V2 has 256-Mbit SDRAM, and the SH-MobileUL 128-Mbit SDRAM, as a SiP (System in Package), enabling compact mounting. Sample shipments will begin in October 2007.

Renesas Technology will continue to develop SH-Mobile Series products that keep pace with evolving multimedia applications and higher speeds in mobile phone systems, and to ensure the timely release of products that fully meet the needs of the market.