OmniVision Launches 14.6-Megapixel, 1080p/60 HD CMOS Imaging Solution

“With the new OV14810, the DSC and DVC market segments are converging, allowing consumers to have one device for capturing their most important photo and HD video moments,” said Devang Patel, senior product marketing manager at OmniVision. “We also see the mobile phone segment moving to full HD video combined with higher resolution photography. We believe that our high performance OV14810 holds great potential for addressing these developments, and may therefore prove to be highly attractive in multiple market segments.”

OmniVision’s new 14.6-megapixel HD sensor uses its most advanced 1.4-micron OmniBSITM pixel architecture to achieve optimal performance and sensitivity in the industry’s smallest format. The 1/2.33-inch OV14810 has an active array of 4,416 x 3,312 backside illumination pixels operating at 15 fps in full resolution, or delivering full 1080p HD video at 60 fps, using a binning feature to achieve higher sensitivity. In full HD video mode, the sensor also provides additional pixels for electronic image stabilization (EIS).
“Our OmniBSI backside illumination technology is now a proven technology for us, with millions of OmniBSI devices already shipped to customers,” said Bruce Weyer, vice president of marketing at OmniVision. “The OV14810 represents a new milestone in digital imaging, bringing the most advanced pixel technology and sensor design to offer the highest quality video and photography in a single device.”

The current trend in both mobile phones and digital cameras is strongly towards HD, and OmniVision's OV14810 is well-positioned to benefit from this move in the market, commented Brian O’Rourke, principal analyst for digital entertainment at In-Stat.
The OV14810 and OV14825 differentiate in chief ray angle (CRA), which optimizes each sensor for its end application: DSC/DVC and mobile. The sensor’s small form factor, facilitated by its CSP packaging, allows for the development of ultra compact cameras. The OV14825 is also available in RW (bare die) for module integrators. The OV14810/OV14825 enables camera designs with a low-cost bill of materials and reduced power consumption. Both sensors are offered with industry-standard connectivity including LVDS, MIPI and DVP and do not require external IC components.

The OV14810/14825 products are sampling now with reference platforms available, and will enter mass production in Q2 2010.