Test & Measurement
Tektronix Component Solutions Increases ASIC and FPGA Test Capacity
Tektronix Component Solutions announced today the investment in five new Teradyne J750EX semiconductor test systems to allow screening of a wider variety of complex ASICs, increase test capacity and enable faster development of new test programs. Reducing development time will improve time-to-test for customers and reduce development cost.
The We're making a significant capital investment to better serve the needs of the high-performance mil-aero market, said Tom Buzak, president, Tektronix Component Solutions.
We are fully committed to equipping our labs with state-of-the-art technology. The Teradyne test systems will help decrease test development time, reducing the cost of test for our customers while enabling the screening of increasingly complex devices.
About Component Test and Screening Services
A strong complement to Tektronix Component Solutions' design, assembly, and test capabilities for custom microelectronics, component screening refers to the testing of electronic components to verify their quality and performance complies with the manufacturer's specifications and meets the customer's application performance and reliability criteria. Examples of the component test services provided by Tektronix Component Solutions include:
• Electrical - Surge testing, parametric testing, functional testing, and device characterization
• Package integrity - highly accelerated stress testing (HAST), particle impact noise detection (PIND), salt fog, thermal shock and temp-cycle, and plastic encapsulated microcircuit (PEM) testing
• Assembly evaluation - destructive physical analysis (DPA), prohibited materials analysis (PMA), scanning electron microscopy (SEM) and X-Ray
• Life-testing - Burn-in, operational life, dynamics, endurance and climatic test
Tektronix Component Solutions services are tailored to test complex parts that will operate in the harsh conditions of military, space and commercial aerospace applications.