RF solutions for T&M applications to be showcased at DesignCon 2020

“Test and measurement applications require connectivity solutions of the utmost quality to ensure measurements are precise and tested devices are fully operational. Without this, processes are slow, data is incorrect, and products do not function as intended,” said Stephanie Jarno, Market Manager at HUBER+SUHNER.

“With the advancement of new emerging applications such as 5G, HUBER+SUHNER offers a comprehensive and flexible approach by pushing the technological boundaries of interconnected test solutions in terms of speed, bandwidth, density and performance.”

The high performing, low loss SUCOFLEX 570S test lead is suitable for a vast range of applications including bench top testing, RF production, automated test equipment, Vector Network Analysers (VNAs), portable testing equipment and RF module testing up to 70GHz.

Developed in response to the most stringent testing requirements, visitors will also witness the electrical stability and reliability of the MXPM90+ multicoax solution which will create revolutionary high speed testing and a frequency rate up to 90GHz+.

Designed for bench top testing, RF module testing and High Speed Digital Testing (HSDT), the multicoax connector solution provides users with a higher level of precision with an advanced magnetic locking mechanism.

“DesignCon 2020 is the perfect opportunity to showcase our latest innovative solutions designed for high-speed communications and semiconductor industries. We look forward to engaging with industry professionals and discussing how our technologies can future-proof their applications,” said Stephanie Jarno, Market Manager at HUBER+SUHNER.