Reliable spring probe pins said to reduce component wear

The task of the spring probe pin is to establish reliable contact to different IC packages such as QFP, BGA, QFN, LGA, and other semiconductor components with a pitch from 0.3 mm (ultra-low pitch) to 2.54 mm. Other possible applications are wafer-level contacting, as well as applications in board-to-board connectors and PCB testing.

The spring probe pin contact mechanism uses the concept of the spring contact. This contact pin combines guaranteed excellent mechanical and electrical characteristics:
1. Durable stable contact design with simultaneous lowest mechanical contact wear, i.e. no degradation of the contact force as well as minimised contact movement on the IC component or PCB contact pad.
2. Reliably low contact resistance (< 50 mΩ), even with differing surfaces.

Spring probe pins consist of a mobile plunger, the cylindrical housing or barrel, and the spring contained within it. The design of the tip is available in different tip styles. There are convex (spherical), conical, and crown-shaped plunger variants available. The upper and lower plunger geometry can also be combined in different ways if needed. There are also variants with only one movable plunger.

Different spring contact pin lengths (min. 1.0 mm) and barrel diameters are available. The smallest diameter available is a mere 0.1 mm.

Depending on customer requirements, the pins can be fabricated from different materials in order to meet both electrical and mechanical requirements. The portfolio covers contact cycle lifetimes of >500k, typical contact forces of 25gf, working temperature ranges of –40°C to +150°C, and a stable, low contact resistance of <50 mΩ.

There are already about 20 different standard types ready and waiting in our Munich warehouse. The minimum order quantity is 100 units. Other versions are available upon request.