Kyzen's Bixenman to present at SMTA Houston

Reliability test methods are performed during the Design for Manufacturing phase to validate process conditions, quality and product reliability. Once the process is signed off by the OEM, CMs do not have a simple test method they can use to verify that the product is being built to designed test levels. Ionic testers were commonly used as a process check, but with the emergence of highly dense interconnects and more complex flux designs, this process tool does not provide an accurate assessment.

A new site specific test method has been designed to run a performance qualification on boards built with the specified soldering materials, reflow settings and cleaning methods in real-time. High impedance measurements are performed on break off coupons designed with component geometries used to build the assembly. This test method provides a gauge of potential contamination sources coming from the build process that can contribute to electrochemical migration. If the process is outside limit values, the CM can do a root cause analysis and correct the problem.