Extended Integration of GOEPEL electronic’s Boundary Scan into Rohde & Schwarz TSVP Platform

They benefit considerably from the utilisation of a newly developed software test type under SYSTEM CASCON named “Interactive ATE”, supporting automatic generation of interactive tests with sequential wiring on the R&S TS-PMB tester matrix.



Furthermore, users now have access to the latest test and programming technologies such as Processor Emulation Test, FPGA Assisted Test and Core Assisted Programming, a multitude of new technological opportunities to further enhance the integration’s capability and value.



“The extended solution allows for the integration of digital and, additionally, analogue test points into the world of Boundary Scan”, says Alexander Beck, Manager System Integration in GOEPEL electronic’s JTAG/Boundary Scan Division. “The combined methods provide users a seamlessly integrated production system featuring all benefits of ICT, FT and Boundary Scan as well as their integrations.”



The R&S TSVP allows the execution of in-circuit tests and functional tests. In addition to a high performance SCANFLEX PXI JTAG controller, the integrated Boundary Scan option contains digital I/O modules PXI 5296 and PXI 52192 with 96 and 192 channels, respectively. These digital test channels are linked with the Virtual ScanPin technology, i.e. the contacted test point acts as an additional, virtual Boundary Scan cell during the test process. Hence, the detection of certain faults is possible only by the interaction of both methods.



These functionalities are extended by the purely analogue pin section of the R&S TS-PMB matrix, controlling GOEPEL electronic’s Boundary Scan software SYSTEM CASCON by means of R&S TS-PSAM (optionally also R&S TS-PSU). An important highlight is the newly developed SYSTEM CASCON test “Interactive ATE”, enabling fully automatic Boundary Scan test generation based on CAD data and R&S TSVP specific data for the description of the hardware configuration.



In addition to the integrated fault report for in-circuit and Boundary Scan tests, the option allows the configuration of PLD/FPGA components, loading of Flash components and programming of microcontrollers.



GOEPEL electronic provides the complete integration package at various levels, differing in hardware performance and software options.



Part of each package is the “CASCON-for-R&S TSVP” installation. This is a kit consisting of software, demonstration reference board and a one-year maintenance contract for both software and hardware.