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GOEPEL electronic to exhibit Industry leading Test Equipment at APEX 2011

8th February 2011

ES Admin

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GOEPEL electronic will present its latest offerings in Multi-Dimensional Boundary Scan Instrumentation as well as chip embedded test, debug and programming tools. By visiting booth 1476, visitors can learn how ChipVORX® technology enables straightforward control of on-chip test, debug and programming functions of any complexity, based on the IEEE 1149.1 test bus protocol – fully synchronous with other JTAG/Boundary Scan operations. The spectrum of possible applications ranges from simple register control, over utilization of primitive test functions, to control of complex instruments. GOEPEL electronic will demonstrate support for new and future JTAG/Boundary Scan related standards such as IEEE 1149.7 or IEEE P1687.

/> GOEPEL introduced more than 30 new Boundary Scan software and hardware products in 2010 and will demonstrate how users can save time and money by applying technology-leading test equipment. Visitors can also inform about Boundary Scan integration opportunities into other automated test equipment.

GOEPEL electronic’s Automated Optical Inspection (AOI) systems, which recently won several industry awards, will also be displayed at this year’s IPC APEX Expo. In particular, the 360 degree angled-view camera module „Chameleon“ generates a hitherto unrivalled field-of-view with excellent image quality, making the inspection of solder joints and components obscured by other components much more accurate and improving overall fault detection capabilities.

From April 12th to 14th, visitors are welcome to find how GOEPEL electronic can provide test solutions to “Get the total Coverage!” for design, production and test engineers.