Agilent Technologies' New Nanoindentation Technique Enables Substrate-Independent Measurements on Thin Film Materials

Our application scientists have created an intelligent, simple-to-use solution to a longstanding nanoindentation challenge, said Jeff Jones, operations manager for Agilent's nanoinstrumentation facility in Chandler, Ariz. The new technique will have an immediate impact on research being conducted across a wide range of disciplines.

Substrate influence is a common problem when using nanoindentation to evaluate the elastic modulus of thin film materials. The technique is able to extract the film modulus from the measured substrate-affected modulus, assuming that the film thickness and substrate modulus are known. The technique is applicable to a variety of film-substrate systems.

Agilent's Jennifer Hay will present an overview of the technique at a special reception during Materials Research Society (MRS) in Boston on Nov. 30. Field luminary Warren Oliver will introduce Ms. Hay at the event.

As the world's most accurate, flexible and user-friendly instrument for nanoscale mechanical testing, the G200 utilizes electromagnetic actuation to achieve unparalleled dynamic range in force and displacement. The G200 enables measurement of Young's modulus and hardness in compliance with ISO 14577, as well as measurement of deformation over six orders of magnitude - from nanometers to millimeters.

Nanomechanical Systems from Agilent Technologies

Agilent Technologies offers high-precision, modular nanomeasurement solutions for research, industry and education. Exceptional worldwide support is provided by experienced application scientists and technical service personnel. Agilent's leading-edge R&D laboratories ensure the timely introduction and optimization of innovative and easy-to-use nanomechanical system technologies.