Texas Instruments brings you the latest in Power

How GaN switch integration enables low THD and high efficiency in PFC

The need for cost-effective solutions to improve power factor correction (PFC) at light loads and with peak efficiency while shrinking passive components is becoming difficult with conventional continuous conduction mode (CCM) control.

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Using interleaved ground planes to improve noise filtering from isolated power supplies

Historically, automotive electronics have been powered off the same 12-V lead-acid battery used to start the vehicle. Even with surges as high as 42 V, which could occur if the generator were running and the battery cable was disconnected, voltages stay in the safety extra-low voltage (SELV) range below 60 VDC. Thus, it was not necessary to worry about the spacing of conducting printed circuit board (PCB) traces to avoid electrical shock hazards in automotive circuitry.

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Isolating a SEPIC

If someone asked you what topology to use for an isolated, low-power output, chances are your first thought would be a flyback. Although a flyback is an excellent topology with benefits such as low cost, low component count and ease of adding additional outputs, it still has several drawbacks.

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How can power ICs reduce inherent and system noise?

Low-noise low-dropout linear regulators (LDOs) and switching converters, precision monitoring, and reliable protection are fundamental to enabling precision signal chains. For applications such as the battery monitoring of medical, test and measurement, battery monitoring of electric vehicles, and more TI uses dedicated power process technologies and advanced circuit and test techniques that increase accuracy, minimize distortion, and reduce noise across both linear and switching power converters.

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TPS563252 and TPS563257 Step-Down Converter Evaluation Module User's Guide

This user's guide introduces the TPS563252EVM and TPS563257EVM. These two devices differ in their light load behaviour. The TPS563252 operates in Eco-mode and the TPS563257 operates in FCCM mode. This user's guide contains information for the TPS563252 and TPS563257 as well as support documentation for the TPS563252EVM and TPS563257EVM evaluation modules.

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Power management

As your partner in power management, we are in constant pursuit of pushing the limits of power: developing new process, packaging, and circuit-design technologies to deliver the best devices for your application. We’re committed to working alongside you to solve key power design challenges – increasing power density, extending battery life, reducing electromagnetic interference (EMI), enhancing power and signal integrity, and making systems even safer. It’s our mission to make more innovation possible for engineers everywhere.

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Powering Sensitive ADC Designs with the TPS62913 Low-Ripple and Low-Noise Buck Converter

High speed analog to digital converters are notoriously sensitive to power supply noise. The most common solution to minimise that noise is to use linear power supplies, or a switch mode power supply (SMPS) from the main bus rail followed by a low dropout regulator. Compared to a linear supply, there are two big advantages of being able to use a SMPS alone: the reduction in power loss and the size of the power supply. To use a SMPS alone requires careful consideration of the switching supply selected, as well as the design and layout of the SMPS to achieve the desired results of the same performance with lower power dissipation and smaller board space.

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Designing an application to support a wide input voltage and battery voltage

It can be challenging for engineers to design applications using rechargeable batteries that provide the best charging experience for consumers when different projects have different battery-charging needs. Using a different battery charger for every application increases design time because you have to redesign, debug, and requalify every new circuit.

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BQ25756EVM

The BQ25756EVM evaluation module (EVM) is a complete evaluation system for BQ25756, a bi-directional charge controller with a wide input and output voltage range of up to 60 V. The BQ25758 device is a wide input voltage, bidirectional switched-mode buck-boost battery charge controller. The device offers high-efficiency battery charging over a wide voltage range with output CC-CV control. The device integrates all the loop compensation for the buck-boost converter, providing a high density solution with ease of use.

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LMG2100R044

The LMG2100R044 device is a 90V continuous, 100V pulsed, 35A half-bridge power stage, with integrated gate-driver and enhancement-mode Gallium Nitride (GaN) FETs. The device consists of two 100V GaN FETs driven by one high-frequency 90V GaN FET driver in a half-bridge configuration.

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LMG3100R017

The LMG3100 device is a 90V, 97A Gallium Nitride (GaN) with integrated driver. The device consists of a 100V GaN FET driven by a high-frequency GaN FET driver. The LMG3100 incorporates a high side level shifter and bootstrap circuit, so that two LMG3100 devices can be used to form a half bridge without needing an additional level shifter.

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UCC33420-Q1

UCC33420-Q1 is an automotive qualified DC/DC power module with integrated transformer technology designed to provide 1.5W of isolated output power. It can support an input voltage operation range of 4.5V to 5.5V and regulate 5.0V output voltage with a selectable headroom of 5.5V.

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CSD95430

The CSD95430RRB NexFET power stage is a highly optimized design for use in a high-power, high density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package.

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TPS2HCS10-Q1

The TPS2HCS10-Q1 device is a dual channel, smart high-side switch controlled through a serial peripheral interface (SPI). The device integrates robust protection to ensure output wire and load protection against short circuit or overload conditions. The device features overcurrent protection which is configurable via SPI in two ranges of thresholds.

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Smart Fuse Evaluation Module

The HSS-HCMOTHERBRDEVM and corresponding daughter cards (such as the HSS-2HCS10EVM) are used to showcase and evaluate all features of the Texas Instruments' smart fuse high-side switch portfolio. The motherboard is designed to be used with several different daughter cards enabling the use of a single host EVM for a variety of different high-side switches with varying on-resistances and functionality. A pre-flashed MCU is included with each HSSHCMOTHERBOARDEVM to act as a USB-to-SPI bridge and allow the user to seamlessly configure/ manipulate the device. This MCU communicates with a Windows® host GUI application titled Smart Fuse Configurator to allow for full configuration and evaluation of the attached high-side switch.

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CSD96416

The CSD96416 NexFET power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm package. This power stage has an adjusted deadtime trim to improve transient response with non-TI controller. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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Breaking the mold: How a new magnetic packaging technology will reshape the future of power modules

A global team of TIers persisted through challenges to develop the new MagPack packaging technology for power modules, a breakthrough that will help advance the future of power design.

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MagPack technology: Four benefits of new power modules that can help you pack more power in less space

Are you working to double the data rate of your next-generation optical module, but within the existing form factor and power budget? Or are you being asked to cram one more sensor into your machine vision system, but are already out of board space and dissipating too much power?

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XPSM828303PVCBR

The TPSM82830x are an easy-to-use, synchronous, step-down, DC/DC module family with integrated inductor and EMI reduction technologies. Based on the DCS-Control topology, the devices have a fast transient response yet with small output capacitance.

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TPSM82816

TPSM8281x are a family of pin-to-pin, 1A, 2A, 3A, 4A, and 6A compatible high efficiency and easy to use synchronous step-down DC/DC power modules with integrated inductors. The devices are based on a fixed-frequency peak current-mode control topology. The devices are used in telecommunication, test and measurement, and medical applications with high power density and ease of use requirements.

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Best of Power Tips

The “Best of Power Tips” e-book compiles the most popular posts from our long-running series with Electronic Design News (EDN). Our power management experts created the Power Tips series to provide insights on common tips and tricks for addressing specific power-supply design challenges. With over 150 articles in the series, we've selected 25 of the most popular articles and compiled them into our “Best of Power Tips" e-book.

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Make sure your optocoupler is properly biased

In isolated power supplies, optocouplers pass the feedback signal across the isolation boundary. Optocouplers contain both a light-emitting diode (LED) and a photo detector. Current flowing through the LED results in a proportional current flowing in the photo detector.

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Designing a flyback DC/DC converter

This video series is dedicated to designing a flyback DC/DC converter. We will guide you through choosing the right topology for your design, explain the fundamentals of flyback converters and discuss design considerations and procedures.

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How to improve flyback efficiency with a nondissipative clamp

In the standard form of a flyback converter, the leakage inductance of the transformer creates a voltage spike on the drain of the primary field-effect transistor (FET). Preventing this spike from becoming excessive and damaging, the FET requires a clamping network, usually with a dissipative clamp.

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