New pressure sensor technology from STMicroelectronics

This unique technology integrates the isolated pressure-sensing element in a fully molded package. This enables fully encapsulated wire bonding with zero risk of corrosion, elimination of wire bonding damage during pick and place assembly, zero risk of cap detachment or cap damage while the device is being mounted, and no impact on the sensor from the soldering process to ensure a more robust packaging solution.

Yole Développement market analysts forecast the MEMS pressure sensor market to grow from $1.9B in 2012 to $3B in 2018. MEMS pressure sensors for consumer applications (specifically for smartphones and tablets) is predicted to represent 1.7 billion units and to overtake automotive as the leading target application for MEMS, adding 8% CAGR to the global MEMS pressure sensor market.

With a production capability of 4 million devices per day and over 800 MEMS-related patents and patent applications worldwide, STMicroelectronics is the world’s top MEMS manufacturer and has shipped more than three billion MEMS devices to date.

ST’s new pressure sensor technology is ideal for a multitude of consumer, automotive and industrial applications including indoor/outdoor navigation, location-based services, enhanced GPS dead-reckoning, altimeter and barometer functions, weather station equipment, and healthcare applications.

According to Benedetto Vigna, Executive Vice President, General Manager, Analog, MEMS & Sensors Group, STMicroelectronics: ‘’This technology represents a revolution in the enhancement of performance and quality for pressure sensors. STMicroelectronics pioneered the use of fully molded packages without gel for high volume manufacturing for Accelerometers and Gyroscopes. We are now leveraging this knowledge to revolutionize the packaging in the emerging field of pressure sensors where STMicroelectronics is the first to use a fully molded package without gel for a high performance pressure sensor with enhanced accuracy.”