ST & Qualcomm collaborate on sensors for smart mobile devices

The reference software is already available to address the specific needs of OEMs creating new devices.

While the agreement extends to all of ST’s inertial modules and sensors (motion, environmental and acoustic), first efforts will focus on supporting ST’s LSM6DS3 inertial module in key Qualcomm reference designs. The LSM6DS3 is an always-on, low-power inertial module combining a 3D accelerometer and a 3D gyroscope with superior sensing precision. The unique, flexible architecture of ST’s sensors complements Snapdragon’s ultra-low power approach to contextual-data processing. It supports extended battery life with Qualcomm All-Ways Aware hub for Android background sensor functions and numerous value-added features including the fusion of sensors with location technology, modem and camera subsystems.

Keith Kressin, Senior Vice President, Product Management, Qualcomm Technologies, commented: “Qualcomm Snapdragon products constitute one of the most technologically influential ecosystems in our increasingly mobile world. We are pleased to work with ST to bring support for Snapdragon based platforms offering users improved sensing capabilities with improved battery life. Our joint efforts in offering superior, robust, tested and certified solutions will help OEMs quickly and efficiently implement across regions.”

“We continue to see the expansion of different sensor types and combinations across the smartphone and mobile markets globally and the work between ST and Qualcomm Technologies is expected to further grow the types of sensors in these devices. We believe that the combination of ST sensors and Qualcomm Technologies’ processors in superior, robust, tested, and certified solutions that OEMs can design-in quickly can enable waves of new ultra-low-power devices to amaze and excite the ecosystem,” added Andrea Onetti, General Manager, MEMS Sensors Division, STMicroelectronics.