Light to digital converter design eliminates wire bonds

16th December 2015

Mick Elliott

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Datasheet

The TSL2584TSV light-to-digital converter (ambient light sensor) from ams is now in stock at Mouser Electronics. At just half the size of similar converter sensors, the TSL2584TSV has a footprint of 1.14 × 1.66 × 0.32mm, enabling designers to add it to thinner wearable products. The sensor’s through-silicon via (TSV) design improves performance by eliminating wire bonds and provides a direct connection from the device’s inputs and outputs (I/Os) to a solder ball.

The light-to-digital converter transforms light intensity into a digital signal output through a two-wire I2C interface capable of data transfer rates of up to 400 kbits per second. The sensor combines a broadband visible plus infrared (IR) photodiode, an IR-responding photodiode, and a photopic IR-blocking filter on a single CMOS integrated circuit.

By filtering out unwanted IR light, the sensor can more accurately measure the ambient light. The TSL2584TSV’s near-photopic response produces a highly accurate lux measurement, even when mounted behind dark glass.

Advanced fabrication technology and the ability to accurately deposit interference filters directly onto the silicon results in a high-performance ambient light sensor.

The TSL2584TSV sensor features two integrating analogue-to-digital converters (ADCs) and a host of programmable features, including analog gain, integration time, upper and lower thresholds, and persistence filter.

The sensor’s TSV design enhances performance reliability with a moisture sensitivity level (MSL) 1 standard rating and improves humidity temperature-cycling performance while minimising corrosion resistivity.

The low-power TSL2584TSV sensor operates from supply voltage of 3V, with a typical active current of 175 µA that drops to just 3 µA in sleep mode. Applications include wearable devices, display backlights, keyboard illumination, and medical diagnostic products.