CMOS sensor enables simultaneous 2D and 3D imaging

The depth mode enables depth mapping concurrently, while shooting video at 30fps. ON Semiconductor's low-cost depth solution empowers both innovative industrial and consumer end-product applications with 3D features like cameras for IoT, wearables, security, and AR/VR/MR.

The AR0430 has an active-pixel array of 2312x1746, achieving a 4:3 aspect ratio. The device provides low-power performance, drawing 125mW, when a 4MP data stream is operating at 30fps. The low power monitoring mode drawing only 8mW in standby, is especially valuable in battery-powered security applications. The AR0430 in standard imaging mode, can provide high quality images in both day and night lighting conditions, thereby enhancing its suitability for use in security cameras.

This imager, with a large linear full well capacity and high dynamic range, succeeds in challenging light conditions with colour performance. It can record video at 120fps in slow motion mode and use the zoom feature, while retaining the resolution quality that is perfect for wearable devices. The feature of depth data at 30fps promotes the possibility of object recognition, virtual replacement, or downstream AI, that can interpret data for autonomous decisions, or touchless device control.

Sibel Yorulmaz-Cokugur, Sensor Expert and ON Semiconductor Line Manager at FRAMOS, considers the innovative application opportunities provided by the AR0430 imager: "In today's world, imaging helps making machines to see, think, and act, predictably. The new AR0430 from ON Semiconductor provides a cutting-edge solution for vision engineers to benefit from the latest 2D and 3D imaging technology using a single device. For example, the user can participate in a video conference while replacing the background for security purposes.

"Also, it is possible to scan objects and to create simple 3D models for use in virtual reality worlds, or even interpret hand gestures to control smart devices. The standard compact sensor size, for Embedded Vision solutions, fits into many IoT applications and supports miniaturisation, too. It also allows multiple camera synchronisation for 360° cameras, or longer-range depth solutions. The fabrication of devices using depth technology as a baseline for innovative 3D applications, and machines driven by artificial intelligence, is now far easier with the AR0430."

Simultaneous video and depth mapping is enabled by ON Semiconductor's Super Depth technology, built on the latest stacked die technology. Super Depth Technology, together with the Colour Filter Array (CFA) feature and on-pixel micro-lenses, creates a data stream containing both image and depth data.

This data is combined off the sensor, via an algorithm, to deliver a 30fps video stream and depth map of any object within one metre of the camera. Imaging engineers and system designers will benefit from the AR0430's significant configuration flexibility. This flexibility includes the ability to programme gain, horizontal and vertical blanking, frame size/rate, exposure, image reversal, window size, and panning. Current engineering samples are available in bare die format, and full production will start later in Q1 2018.

The industry and product experts at FRAMOS apply their extensive knowledge of sensors, latest 3D technology, and vision based artificial intelligence to support customers integrating the new sensor into their applications and projects. This customer service is complemented with development support, customisation, and logistics.