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The rapid development of artificial intelligence (AI) is driving the demand for high-performance processors and placing great demands on electronics manufacturing. ASMPT is meeting these challenges with innovative placement technology that is capable of processing both super-miniaturised components and large, heavy AI chips with exceptional precision.

ASMPT will present its pioneering AMICRA NANO, AMICRA NOVA PRO and MEGA bonding solutions at its booth during the OFC 2025 trade show, from 1-3 April in California.

ASMPT presents Vortex II: a high-performance die bonder for the production of mini LED displays, including those used in the automotive industry.

ASMPT is presenting the the multi-purposes precision pick & place solution NUCLEUS XLplus.

At this year’s PCIM trade event in Nuremberg, ASMPT focuses on power electronics for the vehicle of the future at booth 145 in hall 6.

Dr. Thomas Marktscheffel, Director Product Management Software Solutions at ASMPT, was honoured by the IPC at this year's IPC APEX EXPO in Anaheim, California, for his many years of commitment to the organisation.

ASMPT has been awarded the 2023 Supplier Excellence Award from Texas Instruments (TI) for the second consecutive year.

ASMPT has a new stationary camera available for its placement machines equipped with SIPLACE placement heads CPP and TWIN.

ASMPT has implemented another step in automating product changeovers on the SMT line.

ASMPT has presented its die and module bonding platform that can be used in a variety of ways for producing power modules.