Search results for "asmpt"
ASMPT wins Supplier Excellence Award
ASMPT has been awarded the 2023 Supplier Excellence Award from Texas Instruments (TI) for the second consecutive year.
ASMPT die and module bonding platform
ASMPT has presented its die and module bonding platform that can be used in a variety of ways for producing power modules.
ASMPT and IBM advance bonding for AI Chiplet packages
ASMPT and IBM have announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies.
ASMPT adds to its DEK printing platforms
ASMPT has added two new features to its DEK printing platforms that automate solder paste transfers and simplify squeegee changes.
ASMPT showcased power module solutions at PCIM
At the PCIM Europe event in Nuremberg, ASMPT showcased a comprehensive power module manufacturing solution.
ASMPT combine high-speed chip assembly with SMT placement
With its new SIPLACE CA2 hybrid placement solution ASMPT combines semiconductor and SMT production in a single machine that makes it possible to integrate the production of SiPs (system-in-package modules) directly into the SMT line.
ASMPT launches SMT Analytics
The new SMT Analytics software from ASMPT evaluates the SMT process in detail by identifying and locating problematic aspects that often go unnoticed and can lead to shortfalls in efficiency and performance. The innovative software helps employees to detect the causes of trouble, highlights potential losses, and points out potential improvements.
ASMPT in the semiconductor climate consortium
ASMPT, the innovation and market pioneer in surface-mount and semiconductor manufacturing technology and a Leadership Level founding member of the Semiconductor Climate Consortium (SCC), has officially announced its Net Zero 2035 strategy for climate neutrality.
ASMPT unveil one of its most advanced die bonding systems
ASMPT has unveiled the new version of the AMICRA NOVA Pro in Munich on 17th January 2024. This state-of-the-art platform merges high placement accuracy with swift cycle times and cutting-edge bonding technologies, marking a significant advancement in the field.
ALSI LASER1205: patented precision for SiC wafers
ASMPT, the global provider of hardware and software for semiconductor and electronics production, presents the ALSI LASER1205, a multi-beam laser dicing platform that sets new standards in terms of precision and performance.