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ASMPT has been awarded the 2023 Supplier Excellence Award from Texas Instruments (TI) for the second consecutive year.

ASMPT has presented its die and module bonding platform that can be used in a variety of ways for producing power modules.

ASMPT and IBM have announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies.

ASMPT has added two new features to its DEK printing platforms that automate solder paste transfers and simplify squeegee changes.

At the PCIM Europe event in Nuremberg, ASMPT showcased a comprehensive power module manufacturing solution.

With its new SIPLACE CA2 hybrid placement solution ASMPT combines semiconductor and SMT production in a single machine that makes it possible to integrate the production of SiPs (system-in-package modules) directly into the SMT line.

The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where optical andelectronic componentsare integrated in a common housing.

electronica 2024, one of the world’s most important trade fairs for electronics being held from 12–15 November 2024, will once again bring leading experts, users, and manufacturers to Munich. ASMPT will present its latest technical innovations in the field of bonding for co-packaged optics components and power modules in Hall C3, Booth 300.

ASMPT, the global provider of hardware and software for semiconductor and electronics production, presents the ALSI LASER1205, a multi-beam laser dicing platform that sets new standards in terms of precision and performance.

ASMPTwill participate in the upcoming European Conference on Optical Communication (ECOC) 2024, taking place from 23–25 September 2024 in Frankfurt, Germany.