Search results for "Siemens Digital Industries"

Siemens Digital Industries Software announces that it has expanded the cloud platforms of choice available for systems-of-systems development with its PAVE360 technology for software defined vehicle (SDV) development which is now available on AMD Radeon PRO V710 GPUs and AMD EPYC CPUs running on Azure, Microsoft’s Cloud and AI platform.

Siemens Digital Industries Software has announced, as part of its ongoing collaboration with TSMC, the readiness of an automated and certified workflow for TSMC’s InFO packaging technology using Siemens advanced packaging integration solutions.

Siemens Digital Industries Software recently announced it has signed an exclusive OEM agreement for its EDA business to bring Alphawave Semi's portfolio of high-speed interconnect silicon IP to market through its sales channel.

Siemens Digital Industries Software announced that RIKEN, a national research and development agency in Japan, is improving its resesrch on next-generation AI devices with Siemens' Veloce Strato CS emulation and Catapult High-Level Synthesis (HLS) platforms to conduct architecture and design space exploration of AI accelerator devices.

Electronic Specifier takes a look at the top 5 AI products to have been released in December 2024.

Siemens Digital Industries Software recently announced an extension of its Veloce hardware-assisted verification platform to support 1.6TBps Ethernet.

PhysicsX, a London-based startup bringing the power of generative AI to enable breakthrough engineering in advanced industries, has launched the firstLarge Geometry Model (LGM) for aerospace engineering, LGM-Aero,and a publicly accessible reference application, Ai.rplane, to showcase its power in designing aero structures.

Siemens Digital Industries Software announces that its continued collaboration with longtime customer Samsung Foundry has established a host of new certifications for its recently introduced Solido SPICE software, which supports the verification of next-generation analog, mixed-signal, RF, memory, library IP, and 3D-IC semiconductor designs.

On the 30thand 31stOctober 2024, over 9,800 engineering and manufacturing professionals flocked to the NEC, Birmingham, to attend the 15th edition ofAdvanced Engineering. Across the two days, visitors witnessed the very latest that the industry had to offer, with over 400 exhibitors showcasing their innovations.

Siemens Digital Industries Software announced its ongoing collaboration with Infineon to combine Siemens embeddedautomotive software platform, based on the AUTOSAR Classic platform R20-11, with Infineon’s AURIX TC4x microcontroller.