Search results for "CU Phosco"
CU Phosco launches FL830 floodlighting for airports and beyond
CU Phosco, the family-owned UK designer and manufacturer of outdoor lighting equipment, announces the launch of the FL830, a versatile floodlight designed to meet the demanding lighting requirements of airports, ports, car parks, highway conflict areas, and bridges.
CU Phosco introduces the PhosLink adjustable power connector
CU Phosco, one of the largest family-owned UK designers and manufacturers of outdoorlighting solutions, is proud to announce the launch of a new product, the PhosLink adjustablepower connector.
Enabling lower cost EVs through electric motor development
The electric vehicle (EV) market continues to grow; however, its growth has slowed significantly in Europe and the US in the first half of 2024.
Imec demonstrates new die-to-wafer hybrid bonding
At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...
Flip-chip die bonder from ITEC
ITEC has introduced the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines, attaching up to 60,000 flip-chip dies per hour.
Heraeus Electronics hosts ALL2GaN event
Heraeus Electronics is proud to announce that it will host an upcoming ALL2GaN event from April 9-10, 2024, at its facilities in Hanau.
Dielectric trends in next-gen semiconductor packaging
The semiconductor industry continually pushes packaging technology boundaries to meet the demand for higher chip performance and efficiency.
Kontron Control Panel with the high-performance i.MX8M Plus Processor
Kontron is showcasing its innovative Control Panel product line at embedded world 2024. This lineup, leveraging cutting-edge processor technology, incorporates Kontron's advanced QIWI Toolkit for software integration, with an option for CODESYS SoftPLC utilisation.
MacDermid Alpha boosts semiconductor reliability at IMAPS 2024
MacDermid Alpha Electronics Solutions, a pioneering supplier of integrated materials and chemistries to the electronics industry, is participating at the IMAPS 20th Annual Device Packaging Conference, Arizona 18–21 March 2024.
A patch that allows people to control robotic exoskeletons
Engineers from Korea and the United States have taken a significant step towards integrating human capabilities with robotic exoskeletons, developing a wearable technology that could pave the way for advancements reminiscent of Iron Man. This innovative technology, encapsulated in a stretchable microneedle adhesive patch (SNAP), is designed to enhance the interaction between humans and robotic systems, potentially revolutionising health diagnosti...