Search results for "stmicroelectronics"
Diodes deliver superior efficiency and state-of-the-art robustness
A full range of 2A-40A 1200V silicon-carbide (SiC) JBS (Junction Barrier Schottky) diodes from STMicroelectronics enables a wider range of applications to benefit from the high switching efficiency, fast recovery, and consistent temperature characteristics of SiC technology.
MCUs are supported by extended development ecosystem
STMicroelectronics has begun volume production of ultra-low-power STM32L45x MCUs, supported by a development ecosystem based on the easy-to-use and affordable STM32Cube platform.The STM32L451, STM32L452, and STM32L462 lines integrate a DFSDM, enabling advanced audio capabilities such as noise cancellation or sound localisation on an inexpensive microcontroller. Up to 512 Kbyte on-chip Flash and 160 Kbyte SRAM provide generous code and data storag...
Partnership aims for scalable multi-protocol industrial ethernet platform
Creating cost-efficient and compact industrial slave devices that can connect to any Real-Time Ethernet network is now simpler, through the combination of the STM32 ecosystem with the multi-protocol flexibility of Hilscher’s netX control ICs.The results of this collaboration are the I-NUCLEO-NETX expansion board, for use with any STM32 Nucleo-64/-144 dev board, and the I-CUBE-NETX, an STM32Cube software expansion for combining netX 52 netwo...
Synopsys VC Formal standardised for faster verification
Synopsys has announced that as their formal verification solution for advanced microcontroller designs,STMicroelectronics selected and standardised on Synopsys VC Formal.
Seminars focus on wide bandgap semiconductor advances
A programme of European ‘Wide Bandgap Technology’ seminars which will help design engineers to take advantage of the latest SiC and GaN components has been announced by Future Electronics. SiC (silicon carbide) and GaN (gallium nitride) wide bandgap semiconductor materials are attracting great interest from power engineers because of their superior thermal, switching and power-handling characteristics compared to silicon.
Getting started with stepper motor driver ARM mbed IDE
This video shows how to get started quickly with the x-nucleo development boards and the ARM mbed environment to put together an application that uses a stepper motor driver.
Cutting edge sensors point the way to San Jose
Cutting-edge sensor technologies from a variety of suppliers will be highlighted by Mouser Electronics at the Sensors Expo and Conference 2017,(27-29 June) at the McEnery Convention Center in San Jose, California. The Sensors conference has established itself as the leading event in North America focused on sensors, MEMS, and related technologies within the industry.
Cloud-connectable kit offers fast IoT-device development
The high-connectivity STM32L4 IoT Discovery kit (B-L475E-IOT01A) from STMicroelectronics gives unrivalled flexibility for developers building IoT nodes by supporting multiple low-power wireless standards and Wi-Fi, while integrating a complete collection of motion, gesture, and environmental sensors, unavailable on other kits in the market.
Data centres change power-conversion tactics to save energy
Executed in large data centres, internet applications and services comprise hundreds to thousands of individual serves. Representing a new class of large scale machines these data centres are driven by complex and rapidly evolving workloads.Because of the concentration of powerful computing resources, power consumption is a critical factor in the total cost of ownership and maintenance of the data centre.Alessandro Zafarana, Max Picca, Osvaldo Za...
ENISA & Euro semicon industry work together on key cybersecurity areas
The EU Agency for Network and Information security –ENISA– together with industry recently reached acommon positionon cybersecurity, that reflects the concerns of industry and provides a set of suggestions for policy makers. The paper focuses on four main areas actively debated at the EU level: standardisation and certification, security processes and services, security requirements and implementation, and the economic dimensions.