Search results for "ASIC"
FloorDirector 3.5 Provides Significant Dynamic Power Integrity Benefits at 28 nm
Teklatech today announced the release of version 3.5 of its FloorDirector tool. FloorDirector enables Dynamic Power Shaping leading to reduced peak current demand, dynamic voltage drop and digital power noise in ASIC designs.
SMD pressure sensors for medical technology and pneumatics with a linearised output signal
The smallest pressure sensor from Fujikura has “dream dimensions” of 7 x 7 x 6.5 mm, is named the FGM and can be delivered with a measuring range of 0 - 140 mbar up to 10 bar in various subranges. The least expensive FGM model has a Wheatstone bridge which delivers a non-compensated output signal of approximately 100 mV when fed with a constant current of 1.5 mA. With the most convenient version, the XFGM, there is an ASIC directly on the sil...
DLCD – customizable LCD controller from DCD
Digital Core Design, IP Core and SoC design house, has introduced a proprie-tary LCD controller equipped with 24-bit RGB output and synchronization. Moreover, like all DCD’s cores, the DLCD is provided as a fully synthesizable RTL therefore can be imple-mented in both ASICs/SoCs and FPGAs.
Altera dévoile des atouts révolutionnaires avec les FPGA et SoC
Altera Corporation vient de dévoiler ses FPGA et SoC (système-sur-puce) Generation 10, proposant aux développeurs système des niveaux révolutionnaires de performances et d’efficacité énergétique. Les composants Generation 10 sont basés sur une technologie de process et une architecture optimisée pour fournir les performances les plus élevées de l’industrie et les plus hauts niveaux d’intégration système pour la consommation la...
ASIX Launches USB to Ethernet Controller with Microsoft AOAC Support
ASIX Electronics announced today the AX88772C, a USB 2.0 to 10/100M Ethernet controller with Microsoft AOAC(Always On Always Connected) support. The AX88772C is the latest addition to ASIX’s USB-to-LAN product portfolio, providing a small form factor solution and plug-and-play usability, enabling embedded system designers to deliver Ethernet connectivity while leveraging the proliferation of USB 2.0 technology.
Combined Angular Rate & Acceleration Sensor
PEWATRON introduces Orion, Silicon Sensing’s new family of integrated MEMS high performance Inertial Combi-Sensors, featuring class leading shock and vibration immunity at a fraction of the power consumption and significantly lower cost than previous generation sensors.
Expect a Breakthrough Advantage in Next-Generation FPGAs
This white paper covers examples of why telecommunication bandwidth and the infrastructure behind it is driving FPGA capabilities, business challenges of ASICs and ASSPs, and how a tailored approach for programmable logic devices provide a leap in FPGA capabilities. This paper also outlines a portfolio of nextgeneration FPGAs and SoCs.
Tilera’s TILE-Gx72 Processor Enables 100Gbps Cyber Security Performance
Tilera announced today the commercial availability of software and hardware building blocks to provide scalable 100Gbps cyber security performance for cloud, carrier network, government and enterprise segments.
Digital Differential Pressure Sensor For High Accuracy Monitoring
Omron Electronic Components has added a new digital flow sensor offering exceptionally high accuracy and repeatability in monitoring low air flows. The sensor is an ideal alternative to a differential pressure sensor for optimising energy efficiency in air conditioning and ventilation systems, like variable air volume and heat recovery unit systems or for use in high quality medical equipment and industrial applications.
New R2.1 Type6 COM Express Basic Module With 4th Generation Intel Core Processor
Advantech announces the arrival of SOM-5894 — a COM-Express Basic module powered by the latest 4th generation Intel Core processor. SOM-5894 offers high performance and outstanding graphics, supports multiple combinations of three independent displays, as well as abundant high speed I/O and flexible expansion interfaces up to PCIe x16 gen 3.